Chip packaging structure adopting multi-base island lead frame

A technology of chip packaging structure and lead frame, which is applied in the direction of semiconductor/solid-state device parts, semiconductor devices, electrical components, etc., can solve the problems of low production capacity, high cost, cumbersome scheme, etc., and achieve low cost, easy operation, and realization simple effect
CN111180437AInactive Publication Date: 2020-05-19SHANGHAI BRIGHT POWER SEMICONDUCTOR CO LTD
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Patent Information

Authority / Receiving Office
CN Β· China
Patent Type
Applications(China)
Current Assignee / Owner
SHANGHAI BRIGHT POWER SEMICONDUCTOR CO LTD
Publication Date
2020-05-19
Estimated Expiration
Not applicable Β· inactive patent

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Abstract

The invention discloses a chip packaging structure adopting a multi-base island lead frame. A double-N-substrate diode and two N-substrate diodes are placed on three different base islands to forma diode bridge rectifier. Compared with a traditional four-independent-diode bridge rectifier, the scheme is simpler to implement, easier to operate and lower in cost.
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Description

technical field

[0001] The invention relates to the technical field of semiconductor packaging, in particular to a chip packaging structure using a multi-base island lead frame. Background technique

[0002] With the rapid development of integrated circuit IC design and manufacturing industry, packaging technology has also been greatly improved. Packaging is an important part of the entire integrated circuit manufacturing process, and it has the functions of heat dissipation and protection. The packaging process can seal the chip and isolate the external pollution and damage to the chip by external force.

[0003] With the advancement of technology, packaging a single chip in a package can no longer meet the demand. Encapsulating multiple chips in one package has become the direction of technological development. The chip area is getting smaller and smaller, the power is getting higher and higher, the use environment is getting more and more extreme, the heat dissipation ...

Claims

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