Chip packaging structure adopting multi-base island lead frame

A technology of chip packaging structure and lead frame, which is applied in the direction of semiconductor/solid-state device parts, semiconductor devices, electrical components, etc., can solve the problems of low production capacity, high cost, cumbersome scheme, etc., and achieve low cost, easy operation, and realization simple effect

Inactive Publication Date: 2020-05-19
SHANGHAI BRIGHT POWER SEMICONDUCTOR CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0008] When packaging four independent diodes, multiple independent base islands, multiple glue dispensing and die loading are required, the solution is cumbersome, the production capacity (UPH) is low, and the cost is high

Method used

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  • Chip packaging structure adopting multi-base island lead frame
  • Chip packaging structure adopting multi-base island lead frame
  • Chip packaging structure adopting multi-base island lead frame

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Embodiment Construction

[0028] The technical solutions in the embodiments of the present invention will be clearly and completely described below in conjunction with the accompanying drawings. Apparently, the described embodiments are only some of the embodiments of the present invention, but not all of them. Based on the embodiments of the present invention, all other embodiments obtained by those skilled in the art without creative efforts fall within the protection scope of the present invention. The terms "first", "second", "third", etc. (if any) in the description and claims of the present invention and the drawings are used to distinguish similar objects and not necessarily to describe a specific order or priority. It should be understood that the items so described are interchangeable under appropriate circumstances. Furthermore, the terms "comprising" and "having", as well as any variations thereof, are intended to cover a non-exclusive inclusion.

[0029] In the present invention, a doubl...

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Abstract

The invention discloses a chip packaging structure adopting a multi-base island lead frame. A double-N-substrate diode and two N-substrate diodes are placed on three different base islands to forma diode bridge rectifier. Compared with a traditional four-independent-diode bridge rectifier, the scheme is simpler to implement, easier to operate and lower in cost.

Description

technical field [0001] The invention relates to the technical field of semiconductor packaging, in particular to a chip packaging structure using a multi-base island lead frame. Background technique [0002] With the rapid development of integrated circuit IC design and manufacturing industry, packaging technology has also been greatly improved. Packaging is an important part of the entire integrated circuit manufacturing process, and it has the functions of heat dissipation and protection. The packaging process can seal the chip and isolate the external pollution and damage to the chip by external force. [0003] With the advancement of technology, packaging a single chip in a package can no longer meet the demand. Encapsulating multiple chips in one package has become the direction of technological development. The chip area is getting smaller and smaller, the power is getting higher and higher, the use environment is getting more and more extreme, the heat dissipation ...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H01L25/16H01L25/07H01L23/495
CPCH01L25/16H01L25/165H01L25/072H01L23/49513H01L2224/48247H01L2224/0603H01L2224/49111H01L2224/48137
Inventor 李阳德周占荣徐鹏
Owner SHANGHAI BRIGHT POWER SEMICONDUCTOR CO LTD
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