Multi-size compatible wafer grinding equipment

Abstract

The invention discloses multi-size compatible wafer grinding equipment. The multi-size compatible wafer grinding equipment structurally comprises a grinding machining cavity, a supporting platform anda control case; lifting rods, two grinding discs and an aligning platform are arranged in the grinding machining cavity, the lifting rods are mechanically connected with the grinding discs, and the two grinding discs are arranged at the upper end of the aligning platform; the signal end of the grinding machining cavity is electrically connected with the signal output end of the control case; thesupporting platform is horizontally fixed between the grinding machining cavity and the control case; and a push-out shaft, meshing lines, a sliding cover body, a carrying platform and a cover body lateral sliding mechanism are arranged in the aligning platform. According to the multi-size compatible wafer grinding equipment, the sliding cover body is arranged on the carrying platform, the cover face of the sliding cover body completely covers and is closely attached to the face, bearing a wafer, of the carrying platform, the carrying face of the carrying platform is completely isolated from the outside, the protecting effect is achieved, and damp air can be prevented from entering the carrying face through close attachment of the sliding cover body and the carrying platform, so that enough dryness is guaranteed.

Description

technical field [0001] The invention relates to the technical field of wafer processing, in particular, it is a multi-size compatible wafer grinding equipment. Background technique [0002] Wafers are the raw materials for manufacturing LED chips. During the manufacturing process of wafers, the flatness of the surface needs to be improved by grinding and polishing. Wafer grinder is a processing machine specially used to grind the surface of wafers. It is to install a lifting seat that can be lifted in a straight line and a platform that can be shifted horizontally on a machine table. The lifting platform is equipped with a rotatable grinding wheel, and the wafer is placed on the platform. Through the lifting of the lifting seat and the horizontal movement of the stage, the grinding wheel can be pressed against the surface of the wafer, and the grinding process can be carried out. [0003] Wafer grinding is taken out from the storage box by the conveyor and transferred to th...

AI Technical Summary

Problems solved by technology

[0003] Wafer grinding is taken out from the storage box by the conveyor and transferred to the alignment table, and then the grinding tool starts to grind. In the southern region, the environment is too humid, especially in the south, due to the removal of the storage box The grinding chamber where the wafer is placed is not absolutely sealed, which makes it very easy for humid air to enter the grinding chamber. When the internal environment is damp, a thin layer of moisture will be formed on the surface of the alignment table. When the moisture layer of the alignment table is directly polished, the back of the wafer will be damp, which is not conducive to post-processing. However, the alignment table is placed inside the grinding chamber, so the water layer is thin and difficult to be found, and the water layer is difficult to handle. cumbersome and time-consuming

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