Monitoring system and monitoring method for semiconductor manufacturing device

Abstract

The invention provides a monitoring system and a monitoring method for a semiconductor manufacturing device. The monitoring system comprises a semiconductor manufacturing device and a residual gas analyzer, wherein the semiconductor manufacturing device is provided with a reaction chamber for depositing a semiconductor; and the residual gas analyzer is arranged in the reaction chamber and is provided with a detection unit for detecting the state information in the reaction chamber in real time to obtain the real-time state information. The preparation process in the reaction chamber can be monitored in real time, so that the defects of air leakage, source deterioration, pollution, exhaust and the like can be found in time, a large number of bad products are prevented from being produced, and the production cost is greatly reduced. In addition, as manual monitoring is not needed in the preparation process, not only is the product defect caused by misoperation of operators avoided, but also the burden of the operators is greatly reduced.

Description

technical field [0001] The present invention relates to a semiconductor manufacturing device, in particular to a monitoring system and a monitoring method for the semiconductor manufacturing device. Background technique [0002] Currently, as semiconductors are widely used in digital products such as computers and mobile phones, the manufacturing process of semiconductor products has also received extensive attention. [0003] In an existing semiconductor manufacturing process, a chemical vapor deposition (Chemical Vapor Deposition: CVD) process, a physical vapor deposition (Physical Vapor Deposition: PVD) process, metal physical vapor deposition (metal Physical Vapor Deposition) and the like can be used to manufacture semiconductors. However, with the continuous deepening of device miniaturization, the size of semiconductor structures is getting smaller and smaller, especially when the critical dimensions of semiconductor products are reduced to below 30nm, the requirements...

AI Technical Summary

Problems solved by technology

[0004] However, since the existing technology cannot monitor the process in the reaction chamber of the semiconductor manufacturing device in real time, it is impossible to immediately find the defects such as air leakage, source deterioration, pollution, exhaust, etc., resulting in a large number of defective products. resulting in an increase in production costs

In addition, in the artificially monitored device, it is also possible that the product is defective due to the operator's misoperation, and the artificial monitoring also increases the burden on the operator.

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