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Heat dissipation components and electronic devices for m.2 expansion cards

A technology for heat-dissipating components and electronic devices, which can be used in electrical digital data processing, digital data processing components, instruments, etc., and can solve problems such as difficulty in wiring layout

Active Publication Date: 2021-09-21
GIGA BYTE TECH CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

In particular, the motherboard needs to set multiple screw holes in this area for the M.2 expansion card to be fixed on the motherboard, which makes the wiring layout between the PCI-E interface and the CPU more difficult.

Method used

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  • Heat dissipation components and electronic devices for m.2 expansion cards
  • Heat dissipation components and electronic devices for m.2 expansion cards
  • Heat dissipation components and electronic devices for m.2 expansion cards

Examples

Experimental program
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Embodiment Construction

[0052] figure 1 It is a schematic diagram of an electronic device in a first position and fixed on a motherboard according to an embodiment of the present invention. figure 2 yes figure 1 A schematic side view of the cooling assembly of the M.2 expansion card of the electronic device. see figure 1 and figure 2 , an electronic device 10 of this embodiment includes a motherboard 100 and a heat dissipation assembly 200 of an M.2 expansion card. The motherboard 100 includes an M.2 connector 120 and a single M.2 fixing hole 140 . In addition, the M.2 connector 120 of the electronic device 10 can be configured with an M.2 expansion card 300 . The heat dissipation assembly 200 of the M.2 expansion card includes a heat dissipation element body 220 and a locking member 240 . The heat sink body 220 has a first end 222 and a second end 224 opposite to the first end 222 . In addition, the heat sink body 220 further includes a fixing portion 222 a at the first end 222 and at least...

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PUM

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Abstract

The invention discloses a heat dissipation assembly and an electronic device of an M.2 expansion card. The heat dissipation assembly of the M.2 expansion card is suitable for fixing an M.2 expansion card on a main board, and includes a first end The radiator body and a locking piece. The radiator body includes a fixing portion at the first end and at least one screw hole, and the radiator body is adapted to be fixed on the motherboard through the fixing portion. The locking piece is detachably configured on one of the screw holes, and the locking piece is suitable for fixing the M.2 expansion card to the heat sink body. The invention can reduce the difficulty of main board wiring.

Description

technical field [0001] The invention relates to a heat dissipation component and an electronic device, and in particular to a heat dissipation component and an electronic device of an M.2 expansion card. Background technique [0002] At present, quite a lot of electronic devices have M.2 connectors on the motherboards that can be connected with M.2 expansion cards, so as to facilitate expansion by users. Because the M.2 expansion cards have different sizes, the existing motherboard will need to configure at least 2-3 screw holes near the M.2 connector to fix the expansion cards of different sizes on the motherboard. [0003] However, with the evolution of technology in recent years, such as the advancement of cloud computing, the demand for high-speed signal transmission by the CPU has increased. Among them, more routing configurations are required between the PCI-E interface and the CPU. However, the connector of the M.2 expansion card is mostly set between the PCI-E inte...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): G06F1/20
CPCG06F1/20
Inventor 简源利张燕雲
Owner GIGA BYTE TECH CO LTD