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Enhanced boiling heat transfer surface utilizing synergistic effect of microstructure and composite wettability

A synergistic effect and enhanced boiling technology, applied in the direction of electrical components, electrical solid devices, circuits, etc., can solve problems such as heat transfer deterioration, achieve the effects of enhancing boiling heat transfer performance, enhancing flow field disturbance, and promoting bubble detachment

Active Publication Date: 2020-06-02
CENT SOUTH UNIV
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  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

The boiling process will generate a large number of bubbles. The generation and detachment of a large number of bubbles will agitate the flow field and enhance heat transfer. The sheet-shaped vapor film is wrapped for a long time, and the liquid cannot be replenished in time, which will cause heat transfer to deteriorate

Method used

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  • Enhanced boiling heat transfer surface utilizing synergistic effect of microstructure and composite wettability
  • Enhanced boiling heat transfer surface utilizing synergistic effect of microstructure and composite wettability
  • Enhanced boiling heat transfer surface utilizing synergistic effect of microstructure and composite wettability

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Embodiment Construction

[0019] In order to make the technical solution, purpose and advantages of the present invention clearer, the present invention will be further described below in conjunction with the accompanying drawings and specific working processes.

[0020] see figure 1 , the present invention includes a heating substrate 1 and a number of square pillars 2 arranged on the surface of the heating substrate 1, a number of interpenetrating channels 4 are formed between adjacent square pillars 2, and a chemical modification method is used on the top of each square pillar The surface is provided with a hydrophobic surface layer with an area smaller than that of the top of the square column, forming a partially wettability modified area 3, whose static contact angle is 94°-125°, while the rest of the surface maintains the original wettability, that is, hydrophilicity.

[0021] see figure 2 , image 3 , the square column 2 and the channel 4 of the present invention are processed on the surface...

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Abstract

The invention discloses an enhanced boiling heat transfer surface utilizing the synergistic effect of a microstructure and composite wettability, which comprises a heating substrate and a plurality ofsquare columns arranged on the heating substrate, wherein a plurality of channels are formed between every two adjacent square columns. Besides, a hydrophobic surface layer with the area smaller thanthe area of the top of each square column is arranged on the surface of the top of each square column through a chemical modification method, a partially wettability-modified region is formed, and the original wettability, namely, hydrophilicity, of the other surfaces is kept. The size of the generated bubbles is limited by changing the area of the wettability-modified area on the top of the square column, and on the premise that large-range coalescence of the bubbles on the top and the bubbles on the column side is avoided, the number of vaporization cores can be effectively increased, morebubbles can be generated, flow field disturbance is enhanced, and bubble separation and fresh liquid supplementation are promoted. On the basis of a square column microstructure, the surface utilizesthe synergistic effect of the composite wettability and the structure to realize the enhancement of boiling heat transfer.

Description

technical field [0001] The invention belongs to the technical field of enhanced heat transfer, and in particular relates to an enhanced boiling heat transfer surface utilizing the synergistic effect of microstructure and compound wettability. Background technique [0002] With the rapid development of microelectronics technology, many natural sciences and engineering technologies are moving towards the direction of miniaturization. However, the rapid increase in the integration of microelectronic devices makes the heat flux density of integrated circuit chips higher and higher, and the heat dissipation problem has become one of the important bottlenecks restricting its performance development. Boiling heat transfer utilizes latent heat of phase change to generate a relatively high heat flux density at a small temperature difference. Compared with traditional air cooling and single-phase liquid convective cooling methods, the heat transfer coefficient of boiling heat transfer...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H01L23/427
CPCH01L23/427
Inventor 李庆文哲希李万新黄俊壹
Owner CENT SOUTH UNIV
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