Heat dissipation structure and installation method thereof

Abstract

The invention discloses a heat dissipation structure and an installation method thereof. The heat dissipation structure comprises a casing, a flow channel body arranged on the casing, a cooling flow channel arranged in the flow channel body, and a PCB provided with at least one heating element, wherein the heating element is clamped between the flow channel body and the PCB, the heating element isattached to the outer wall of the flow channel body through a heat conduction assembly, and the heat conduction assembly comprises a ceramic substrate for insulating and isolating the heating elementfrom the flow channel body. According to the invention, the PCB is inversely mounted, the heating elements are in contact with the flow channel body through the ceramic substrate for heat transfer, and the heat dissipation effect is remarkably improved. Due to the good heat dissipation performance, the power of the single heating element in the product can be improved, so that the number of the heating elements is reduced, and the effects of reducing the cost and the size are achieved.

Description

technical field [0001] The invention relates to the technical fields of pure electric and hybrid vehicle charging and voltage conversion, in particular to heat dissipation structures and installation methods of products such as vehicle chargers and voltage converters. Background technique [0002] With the demand for energy saving, emission reduction and control of air pollution, new energy vehicles are gradually commercialized in the market, and electric vehicles are the main force of new energy vehicles. Electric vehicles are further divided into pure electric vehicles and hybrid vehicles, in which on-board charger OBC, voltage converter DCDC, on-board charger OBC and voltage converter DCDC are integrated products are important components of electric vehicles, and switching tubes Heating elements such as MOSFETs are also important components of the on-board charger OBC and the voltage converter DCDC. [0003] When the switch tube works, it will generate a lot of heat, and...

AI Technical Summary

Problems solved by technology

[0007] In order to solve the defect of insufficient heat dissipation capacity of the existing heat dissipation structure, the present invention proposes heat dissipation structures and installation methods for products such as on-board chargers and voltage converters, in which the heating element is arranged between the PCB circuit board and the flow channel body, The heat dissipation surface directly contacts the runner body to dissipate heat through the heat conduction component, which greatly improves the heat dissipation efficiency

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