Multi-mode dustproof heat dissipation case

A multi-mode, dust-proof technology, applied in the computer field, can solve the problems of dust-proof and heat dissipation of the chassis, and achieve dust-proof and heat-dissipation firmness, cleanliness, and small size

Active Publication Date: 2020-06-05
金品计算机科技(天津)有限公司
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  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0003] In view of the above situation, in order to solve the problems existing in the prior art, the purpose of the present invention is to provide a multi-mode dust-proof and heat-dissipating chassis, which can effectively solve the dust-proof of the chassis Problems that cannot be balanced with heat dissipation

Method used

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  • Multi-mode dustproof heat dissipation case
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  • Multi-mode dustproof heat dissipation case

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Embodiment Construction

[0015] The specific implementation manners of the present invention will be described in further detail below in conjunction with the accompanying drawings.

[0016] Depend on Figure 1 to Figure 7 Given, the present invention comprises a box plate 1, and two through holes 2 are provided on the box plate 1, and a fan 3 is installed in the through holes 2; Net 4, the outside of the first filter screen 4 is equipped with the second filter screen 5 that can move left and right, and the outside of the second filter screen 5 is equipped with the third filter screen 6 that can move left and right; the first filter screen 4, the second filter screen The number of meshes of the net 5 and the third filter screen 6 increases successively; the three filter screens are composed of four faces, the front, the rear, the top, and the bottom; The left side is fixed with a second baffle 8 that can be tenoned with the first baffle 7; the left side of the third filter screen 6 is fixed with a th...

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Abstract

The invention relates to a multi-mode dustproof heat dissipation case which effectively solves the problem that dust prevention and heat dissipation of a case cannot be achieved at the same time. According to the technical scheme, the case comprises a box plate, two through holes are formed in the box plate, and fans are installed in the through holes; three layers of filter screens are fixed at the left side of the box plate; three baffles are arranged outside three layers of filter screens; a plurality of transverse outer guide rods and a plurality of transverse inner guide rods penetrate through the box plate, the outer guide rods can push the outer-layer filter screen to move, the inner guide rods can push the middle-layer filter screen to move, permanent magnets are fixed to the rightends of the outer guide rods and the right ends of the inner guide rods, and a plurality of outer electromagnets matched with the permanent magnets on the outer guide rods in a one-to-one mode are fixed to the box plate; a plurality of inner electromagnets in one-to-one fit with the permanent magnets on the inner guide rods are fixed on the box plate; and the outer electromagnets and the inner electromagnets are controlled by a temperature control system to be powered on and off. The case is small in size, low in weight and capable of automatically adjusting the dustproof effect according totemperature change.

Description

technical field [0001] The invention relates to the field of computers, in particular to a multi-mode dust-proof and heat-dissipating chassis. Background technique [0002] A computer case is generally provided with a plurality of case fans, so that the inside of the case forms a front-to-back airflow for heat dissipation. However, because there is a lot of dust in the air, there are also some poplar catkins, paper scraps, and other sundries that are easy to adhere to the case; therefore, after the case is used for a certain period of time, more dust will accumulate inside the case. Especially the internal graphics card and CPU radiator will accumulate a lot of sundries and dust, which will seriously affect the heat dissipation effect. It is precisely because of the excessive dust that many users currently choose to paste a relatively dense dust-proof film on the fan of the chassis, which can effectively block the entry of dust, but while reducing the entry of dust, it also...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): G06F1/18G06F1/20
CPCG06F1/181G06F1/20
Inventor 马耀锋李红丽潘会强魏富豪杨洪彩
Owner 金品计算机科技(天津)有限公司
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