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A kind of lpddr substrate design method, lpddr substrate and electronic equipment

A design method and substrate technology, which is applied in the manufacture of printed circuits, electrical components, printed circuits, etc., can solve problems such as lead wire residues, achieve the effects of concentrated etching areas, convenient inspection, and meet performance requirements and aesthetic requirements

Active Publication Date: 2021-07-30
SHENZHEN DEMINGLI ELECTRONICS
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Problems solved by technology

[0004] The main purpose of the present invention is to provide a method for designing an LPDDR substrate, aiming at solving the problem of residual wires after the etching of the LPDDR substrate

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  • A kind of lpddr substrate design method, lpddr substrate and electronic equipment
  • A kind of lpddr substrate design method, lpddr substrate and electronic equipment
  • A kind of lpddr substrate design method, lpddr substrate and electronic equipment

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Embodiment Construction

[0031] It should be understood that the specific embodiments described here are only used to explain the present invention, not to limit the present invention.

[0032] refer to Figure 5 , the present invention provides a method for designing an LPDDR substrate, comprising:

[0033] S1: Determining the chip packaging area 4 on the LPDDR substrate;

[0034] S2: A first etching area 1 and a second etching area 2 are respectively provided in the adjacent areas at both ends of the chip packaging area 4, wherein the first etching area 1 and the second etching area 2 are both used for setting the first electroplating lead 3, The first electroplating lead 3 is electrically connected to the circuit network to be electroplated on the LPDDR substrate.

[0035] In the embodiment of the present invention, the basic design process of the PCB board is as follows: the first step is the preliminary preparation, including the preparation of the component library and the schematic diagram; t...

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Abstract

The present invention discloses a method for designing an LPDDR substrate, an LPDDR substrate and electronic equipment. The method for designing an LPDDR substrate includes: determining a chip packaging area on the LPDDR substrate; An etching area and a second etching area, wherein both the first etching area and the second etching area are used for setting a first electroplating lead, and the first electroplating lead is electrically connected with the circuit network to be electroplated on the LPDDR substrate. This design method concentrates the etching area of ​​the electroplating lead, which is convenient for later inspection, and there is almost no residual lead tail, which solves the disadvantages caused by the traditional substrate design and meets the performance requirements and aesthetic requirements of the LPDDR substrate.

Description

technical field [0001] The invention relates to the field of storage devices, in particular to an LPDDR substrate design method, an LPDDR substrate and electronic equipment. Background technique [0002] On the PCB board, copper is used to interconnect the components on the substrate. Although it is a good conductor material for forming the surface pattern of the PCB conductive path, if it is exposed to the air for a long time, it is easy to lose due to oxidation. Gloss, loses weldability due to exposure to corrosion. Therefore, electroplating techniques are used to protect copper traces, vias, and plated through holes. [0003] Copper printed lines need to be electroplated through leads. The traditional lead design is on the bottom of the substrate. Since it is necessary to etch outside the wafer chip as much as possible, a large number of circuits need to be lead out of the product, and the wiring is complicated. Such as figure 1 with 2 as shown, figure 2 The parts i...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): H05K3/00H05K3/02H05K3/18
CPCH05K3/0002H05K3/022H05K3/18
Inventor 李虎谭少鹏
Owner SHENZHEN DEMINGLI ELECTRONICS
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