Cleaning device and cleaning method

Abstract

The invention provides a cleaning device and a cleaning method. The cleaning device comprises an electrostatic precipitator and a driving component, wherein the electrostatic precipitator comprises adust collection electrode and a corona electrode; the driving component at least comprises two telescopic units and a rotating unit; the telescopic units are connected with the electrostatic precipitator, and displacement of the electrostatic precipitator is controlled through the telescopic units; the rotating unit is connected with the telescopic units and located between the telescopic units; and the direction of the telescopic units is controlled through the rotating unit. According to the cleaning device and the cleaning method provided by the invention, the position of the electrostaticprecipitator is regulated through the driving component in the cleaning device, and operation convenience is improved; the electrostatic precipitator is used for electrostatic precipitation; accordingly, the cleaning device in semiconductor equipment can effectively clean particles suspended in the air and is short in cleaning time, high in cleaning efficiency and good in cleaning effect; and external particles cannot be introduced into the semiconductor equipment in the cleaning process, resources can be saved, and the yield of products can be increased.

Description

technical field [0001] The invention belongs to the field of semiconductor integrated circuits, and relates to a cleaning device and a cleaning method. Background technique [0002] In the field of semiconductor integrated circuits, the photolithography process has always been considered the most critical step in the manufacture of integrated circuits, which needs to be used multiple times throughout the process and has an important impact on product quality. [0003] The photolithography process is a process technology that uses optical and chemical reactions and chemical and physical etching methods to transfer circuit patterns to the surface of a single crystal or a dielectric layer to form effective pattern windows or functional patterns. [0004] In the glue coater that coats the surface of the wafer and in the photolithography machine that exposes the photoresist coated on the surface of the wafer, there are usually reaction by-products, although most of the reaction b...

AI Technical Summary

Problems solved by technology

However, the method of wiping with a dust-free cloth will result in long cleaning time, low cleaning efficiency, poor cleaning effect, inability to clean particles suspended in the air, and foreign particles may be introduced during the cleaning process, which will cause waste of resources and Potential harm to product yield

[0005] Therefore, it is necessary to provide a cleaning device and cleaning method to solve the waste of resources caused in the cleaning process and the potential harm to the yield of products.

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