Dispensing head on packaging dispensing equipment

Abstract

The invention discloses a dispensing head on packaging dispensing equipment. The dispensing head on the packaging dispensing equipment comprises a cylindrical annular sleeve seat, the lower end of thesleeve seat is provided with a glue outlet head of which the section is in a crossed shape, and a cross-shaped glue outlet groove communicating with an inner cavity of the sleeve seat is formed in the glue outlet head; the upper end of the sleeve seat is provided with a connecting sleeve of which the section is in a prismatic shape, the connecting sleeve is composed of two opposite conical sleeves, and the upper end of the connecting sleeve is provided with a vertical connecting pipe; a cylindrical supporting seat and a circular-truncated-cone-shaped valve plate are inserted into the connecting sleeve, and the circular-truncated-cone-shaped valve plate abuts against the inner wall of the upper end of the connecting sleeve; and a through hole penetrating through the lower end face of the supporting seat is formed in the supporting seat, the outer wall of the middle of the supporting seat is provided with an annular platform, the outer wall of the annular platform is provided with a supporting plate, the outer edge of the supporting plate is fixed to the inner wall of the lower end face of the supporting seat, and a lower permanent magnet block is fixedly inserted into a supportingseat through hole formed in the inner side of the annular platform.

Description

technical field [0001] The invention relates to the technical field of chip encapsulation devices, in particular to a dispensing head on encapsulation dispensing equipment. Background technique [0002] At present, the chip packaging process includes chip bonding, silver paste curing, lead welding, light inspection, injection molding, laser typing, high temperature curing, flash removal, electroplating annealing, rib cutting and forming, etc.; in the chip bonding process, it is necessary to use Epoxy resin is dripped on the upper surface of the chip to fix the chip and the wafer, which is convenient for subsequent injection molding packaging; the existing epoxy resin drip is called dispensing for short, and dispensing is carried out by dispensing equipment. Peristaltic pumps are generally used for epoxy resin delivery. After the dispensing is completed, the peristaltic pump is turned off. However, after the peristaltic pump is turned off, there is still force between the epo...

AI Technical Summary

Problems solved by technology

[0002] At present, the chip packaging process includes chip bonding, silver paste curing, lead welding, light inspection, injection molding, laser typing, high temperature curing, flash removal, electroplating annealing, rib cutting and forming, etc.; in the chip bonding process, it is necessary to use Epoxy resin is dripped on the upper surface of the chip to fix the chip and the wafer, which is convenient for subsequent injection molding packaging; the existing epoxy resin drip is called dispensing for short, and dispensing is carried out by dispensing equipment. Peristaltic pumps are generally used for epoxy resin delivery. After the dispensing is completed, the peristaltic pump is turned off. However, after the peristaltic pump is turned off, there is still force between the epoxy resins being transported, and a small amount of epoxy resin will drip from the dispensing head. Contaminates production line; needs to improve dispensing head to reduce dripping of excess epoxy

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