Memory module test temperature control device and control method, computer equipment and storage medium

Abstract

The invention relates to a memory module test temperature control device and method, computer equipment and a storage medium. The control device includes: a controller; a test mainboard, a temperaturecontrol module, a high-temperature cover assembly and a hollow plate. A plurality of to-be-tested memory modules are inserted into the test mainboard. The hollow plate is arranged above the test mainboard; the top end of the memory module penetrates out of the hollowed-out plate and is partially exposed above the hollowed-out plate; the high-temperature cover assembly is arranged above the hollowed-out plate and covers the periphery of the memory module, the input end of the temperature control module is connected with the test mainboard, the output end of the temperature control module is connected with the high-temperature cover assembly, and the temperature control module receives memory temperature data from the test mainboard, issues a temperature control instruction to the high-temperature cover assembly and adjusts the test temperature of the memory module. The hollowed-out plate is arranged above the test mainboard, the high-temperature cover assembly is placed on the hollowed-out plate, the temperature control space of the high-temperature cover assembly is reduced, temperature adjustment is accelerated, meanwhile, the test mainboard and the high-temperature cover assembly can be separated, and the service life is prolonged.

Description

Technical field [0001] The invention relates to the field of memory module testing, and more specifically to a memory module testing temperature control device, control method, computer equipment and storage medium. Background technique [0002] The industry currently uses high-temperature cabinets to perform high-temperature tests on DRAM memory modules. By placing the test motherboard in the high-temperature cabinet and setting the temperature of the high-temperature cabinet, high-temperature testing of DRAM memory modules under the system is achieved. At the same time, the test equipment used in the test is expensive. The quantity is scarce. [0003] Existing DRAM memory module tests have the following disadvantages: [0004] 1. The high temperature test memory under DRAM memory module system is inconvenient to plug and unplug, the test equipment is expensive and the cost is high: [0005] 2. The motherboard is tested for memory system at high temperature in a high temperature cab...

AI Technical Summary

Problems solved by technology

[0004] 1. It is inconvenient to plug and unplug the memory under the high temperature test of the DRAM memory module system, the test equipment is expensive, and the cost is high:

[0005] 2. The main board is tested for the memory system under high temperature in a high-temperature cabinet. The working environment of the main board has a high temperature, which affects the operation of the main board components and reduces the test performance;

[0006] 3. The high-temperature cabinet can only control the ambient temperature around the DRAM memory module, and cannot precisely control the surface temperature of the DRAM memory module;

[0007] 4. The temperature control space of the high-temperature cabinet is large, and the test power consumption is high

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