Supercharge Your Innovation With Domain-Expert AI Agents!

Electromagnetic wave absorbing film and electromagnetic wave absorbing composite substrate including same

An electromagnetic wave, absorbing film technology, applied in the reduction of crosstalk/noise/electromagnetic interference (circuit devices, electrical components, etc., can solve problems such as thickening thickness, difficult to cope with the trend of thinning terminal equipment, etc., to simplify the manufacturing process. , to ensure the effect of magnetic permeability and high magnetic permeability

Active Publication Date: 2022-04-05
DOOSAN CORP
View PDF7 Cites 0 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Therefore, the thickness of the magnetic field absorbing film becomes thicker, and there is a problem that it is difficult to cope with the trend of thinning terminal equipment.

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Image

Smart Image Click on the blue labels to locate them in the text.
Viewing Examples
Smart Image
  • Electromagnetic wave absorbing film and electromagnetic wave absorbing composite substrate including same
  • Electromagnetic wave absorbing film and electromagnetic wave absorbing composite substrate including same
  • Electromagnetic wave absorbing film and electromagnetic wave absorbing composite substrate including same

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1～6

[0116] 1-1. Production of thermosetting composition for electromagnetic wave absorbing layer formation

[0117] The components of the thermosetting composition for forming an electromagnetic wave absorbing layer were mixed and manufactured according to the ratio of the compounding example of the following [Table 1]. The usage unit of each composition in the following Table 1 is parts by weight.

[0118] 1-2. Manufacture of electromagnetic wave absorbing film

[0119] On one side of the polyimide layer (12 μm), apply the thermosetting composition for forming an electromagnetic wave absorbing layer in the above 1-1 to form an electromagnetic wave absorbing layer (PMS layer), and make it dry to a thickness of 60 μm. The adhesive layer (12 μm) was sequentially applied and dried, and a release paper was arranged to produce a cover film layer with a thickness of 24 μm.

[0120] After arranging a protective film composed of a polyimide layer (25-50 μm) with an adhesive layer (P...

experiment example 1

[0134] The properties of the electromagnetic wave absorbing films produced in Examples 1 to 6 and Comparative Examples 1 to 2 were measured according to the following measurement methods, and the results are shown in Table 1 above.

[0135] 1) Peel strength

[0136] According to JIS C6471, when the electromagnetic wave absorbing layer (PMS layer) is peeled at a speed of 50 mm / min at a rate of 50 mm / min under the condition of 25 ° C, the surface of the polyimide (PI) layer of the above-mentioned cover film is measured at 90 degrees. The minimum force required and expressed as peel strength.

[0137] 2) Evaluation of heat resistance

[0138] According to JIS C6471, the electromagnetic wave absorbing film was cut|disconnected by 25 mm square, the test piece was manufactured, and this test piece was floated on the solder bath of 288 degreeC. Then, the time until blisters occurred on the surface of the electromagnetic wave absorbing film was measured.

[0139] 3) Permeability ev...

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

PUM

PropertyMeasurementUnit
peel strengthaaaaaaaaaa
peel strengthaaaaaaaaaa
thicknessaaaaaaaaaa
Login to View More

Abstract

The present invention is applied to various portable electronic devices including a portable terminal device having a digitizer function to shield the electromagnetic field generated by various parts of the main body of the portable terminal device, and at the same time, due to the integration of the electromagnetic wave absorbing layer and the cover film layer, An electromagnetic wave absorbing film and an electromagnetic wave absorbing composite substrate including the same realize the simplicity and economy of the manufacturing process.

Description

technical field [0001] The present invention relates to an electromagnetic wave absorbing film and an electromagnetic wave absorbing composite substrate including the same. More specifically, it relates to a portable terminal device capable of absorbing and shielding electromagnetic fields generated by various parts of the main body of the terminal device when realizing the function of a digitizer, and at the same time An electromagnetic-wave-absorbing film and an electromagnetic-wave-absorbing composite substrate including the electromagnetic-wave-absorbing film in which an electromagnetic-wave-absorbing layer and a cover film layer are integrated to ensure simplicity and economy of the manufacturing process. Background technique [0002] In recent years, portable terminal devices such as smartphones equipped with a digital converter (Digitizer), that is, a digital tablet function have been released and gained popularity. Such a digitizer can draw a line with a thickness of...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

Application Information

Patent Timeline
no application Login to View More
Patent Type & Authority Patents(China)
IPC IPC(8): H05K9/00B32B27/28B32B15/08H05K1/02
CPCB32B15/08B32B27/28H05K1/02H05K9/00H05K9/0075B32B27/281H05K9/0084H05K1/0218
Inventor 郑允皓林太极韩彬
Owner DOOSAN CORP
Features
  • R&D
  • Intellectual Property
  • Life Sciences
  • Materials
  • Tech Scout
Why Patsnap Eureka
  • Unparalleled Data Quality
  • Higher Quality Content
  • 60% Fewer Hallucinations
Social media
Patsnap Eureka Blog
Learn More

Browse by: Latest US Patents, China's latest patents, Technical Efficacy Thesaurus, Application Domain, Technology Topic, Popular Technical Reports.

© 2025 PatSnap. All rights reserved.Legal|Privacy policy|Modern Slavery Act Transparency Statement|Sitemap|About US| Contact US: help@patsnap.com