Laminated body including novolac resin as peeling layer

A phenolic novolac resin and laminate technology, which is applied in the direction of synthetic resin layered products, layered products, electric solid devices, etc., can solve the problems of large chip damage, heat generation, gas generation, etc.

Pending Publication Date: 2020-06-19
NISSAN CHEM IND LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0006] However, the temporary adhesive used in these bonding and separation processes may generate heat and generate gas when irradiated with laser light, so the damage to the wafer is large.

Method used

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  • Laminated body including novolac resin as peeling layer
  • Laminated body including novolac resin as peeling layer
  • Laminated body including novolac resin as peeling layer

Examples

Experimental program
Comparison scheme
Effect test

Embodiment

[0148] (Preparation of Adhesive A for forming an adhesive layer)

[0149] Into a 600 mL stirring container dedicated to an autorotation and revolution mixer (manufactured by Shinky Co., Ltd., ARE-500), 95 g of vinyl group-containing MQ resin (manufactured by Wakka Chemi Co., Ltd.) as a polysiloxane (a1) and 95 g of a diluting solvent were added. 93.4 g of p-menthane (manufactured by Japan Terpen Chemical Co., Ltd.) and 0.41 g of 1,1-diphenyl-2-propen-1-ol (manufactured by Tokyo Chemical Industry Co., Ltd.) ) Shinki, ARE-500) was stirred for 5 minutes. To the obtained mixture were added SiH group-containing linear polydimethylsiloxane (manufactured by Wakka Chemical Co., Ltd.) having a viscosity of 100 mPa·s as polysiloxane (a2), 29.5 g of vinyl-group-containing linear polydimethylsiloxane (manufactured by Wakka Chemical Co., Ltd.) with a viscosity of 200 mPa·s, and a viscosity of 1,000,000 mm as component (B) 2 0.41 g of polyorganosiloxane (manufactured by Wakka-chemi Co., L...

Synthetic example 1

[0152] Into a 100 mL four-necked flask under nitrogen, 8 g of carbazole (manufactured by Tokyo Chemical Industry Co., Ltd.), 7.55 g of 1-naphthaldehyde (manufactured by Tokyo Chemical Industry Co., Ltd.), and p-toluenesulfonic acid monohydrate (manufactured by Kanto Chemical Industry Co., Ltd.) were added. Co., Ltd.), 8 g of 1,4-dioxane (manufactured by Kanto Chemical Co., Ltd.) was added and stirred, and the temperature was raised to 100° C. to dissolve them and start polymerization. After 4 hours, it was left to cool to 60° C., then diluted with 40 g of chloroform (manufactured by Kanto Chemical Co., Ltd.), and reprecipitated in 200 g of methanol. The obtained precipitate was filtered and dried in a decompression dryer at 60°C for 10 hours, and then at 120°C for 24 hours to obtain the target polymer (having the structural unit of formula (C1-1-1-1) polymer). Hereinafter abbreviated as PCzNA) 10.03g.

[0153] PCzNA had a weight average molecular weight Mw of 2600 in terms o...

Synthetic example 2

[0155] 15.00 g of 4,4'-biphenol (manufactured by Tokyo Chemical Industry Co., Ltd.), 18.55 g of 1-pyrylene formaldehyde (manufactured by Aldrich Co., Ltd.) and p-toluenesulfonic acid monohydrate were added to a 300 mL four-necked flask under nitrogen gas (Tokyo Chemical Industry Co., Ltd. product) 33.210g, Furthermore, propylene glycol monomethyl ether (Kanto Chemical Co., Ltd. product) 44.93g was added, and it heated up to 120 degreeC with stirring, these were melt|dissolved, and polymerization started. After 24 hours, it was left to cool to room temperature, and reprecipitated in 1800 g of methanol. The obtained precipitate was filtered and dried in a vacuum dryer at 50°C for 10 hours to obtain the target polymer (a polymer having a structural unit of the formula (C1-3-1-4). Hereinafter, it will be abbreviated as PBPPCA. ) 19.08g. The weight average molecular weight Mw in terms of polystyrene measured by PBPPCA was 2,200.

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Abstract

[Problem] To provide: a laminated body comprising an intermediate layer which is adhered in a peelable manner between a support body and an item to be processed, the laminated body being configured toseparate the item to be processed by cutting and the like or to perform processing such as polishing a wafer backside, wherein the intermediate layer includes a peeling layer in contact with at leastthe support body side, the peeling layer including a novolac resin which is transformed by absorbing light of 190 nm to 600 nm irradiated via the support body; a material that can be separated without mechanical addition; and a method. [Solution] Provided is a laminated body for polishing the backside of a wafer, the laminated body comprising an intermediate layer bonded in a peelable manner between a support body and a circuit surface of the wafer. The intermediate layer comprises an adhesive layer contacting the wafer side and a peeling layer contacting the support body side. The peeling layer includes a novolac resin which is transformed by absorbing light of 190 nm to 600 nm irradiated via the support body. The peeling layer has an optical transmissivity of 1 to 90% in a range of between 190 nm and 600 nm. The transformation due to optical absorption is photodecomposition of the novolac resin.

Description

technical field [0001] The present invention relates to a laminate for processing a workpiece having a releasably bonded intermediate layer between a support and a workpiece, and to a temporary adhesive in which the intermediate layer can be separated by ultraviolet irradiation . In particular, it relates to a temporary adhesive for fixing a wafer to a support when polishing the back surface of the wafer, and a laminate using the temporary adhesive. Background technique [0002] Conventionally, semiconductor wafers stacked in a two-dimensional planar direction have been pursued for the purpose of further stacking semiconductor wafers in a three-dimensional direction. This three-dimensional lamination is a technique of stacking multiple layers while connecting wires through silicon through electrodes (TSV: through silicon via). In the case of multilayer stacking, the stacked wafers are thinned by grinding the opposite side (that is, the back side) of the circuit-forming sur...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H01L21/304B32B7/023B32B7/06B32B27/00H01L21/02H01L21/683
CPCH01L21/6835H01L2221/68327H01L2221/68381H01L2221/68386H01L23/562H01L2221/6834C09J7/20C09J183/04C09J7/405C08L63/04H01L21/6836H01L21/304C09J7/38B32B7/023B32B7/06B32B7/12B32B27/16B32B27/38B32B2250/02B32B2250/03B32B2307/40B32B2310/0831B32B2315/08B32B2363/00B32B2457/14C09J2483/00
Inventor 荻野浩司西卷裕和柄泽凉新城彻也上林哲森谷俊介奥野贵久
Owner NISSAN CHEM IND LTD
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