Substrate bonding apparatus

Abstract

The present invention relates to a substrate aligning device for bonding a first substrate and a second substrate, wherein the first substrate and the second substrate have respective bonding surfacesvia which the first substrate and the second substrate are bonded face-to-face with each other, and respective non-bonding surfaces which are located on the reverse sides from the bonding surfaces. The first substrate, the second substrate, a first support and a second support are included. The first substrate and the second substrate are arranged, and the first substrate is formed by a first pasting face and a first non-bonding face located on the back face of the first pasting face; the second substrate is formed by a second pasting surface and a second non-bonding surface located on the back surface of the second pasting surface. The first support is used for installing the non-bonding surface of the firs substrate, the second support is used for mounting the second non-bonding surfaceof the second substrate.

Description

technical field [0001] The present invention relates to a substrate arrangement device, and more particularly to a method for precisely arranging two different substrates by using a substrate support. Background technique [0002] Substrate bonding technology is used in the manufacture of semiconductors, LEDs, micro-electromechanical systems (MEMS) sensors, WLP (Wafer Level Package), high bandwidth memory (HBM: High Bandwidth Memory), and multiple chip stacking technologies. Currently, since the substrates are bonded with an adhesive and wiring is formed thereafter, precise arrangement of the substrates is not required. [0003] However, recently, a technique of directly connecting wiring formed on a substrate by bonding to realize electrical connection between the substrates at the same time as the bonding has been used. Therefore, it is necessary to precisely arrange the substrates before bonding the substrates. [0004] For example, after the substrates are precisely arr...

AI Technical Summary

Problems solved by technology

However, when the two substrates arranged are all opaque or impenetrable, it has the disadvantage of being unusable, and when the substrate is opaque and there is an alignment key (Alignkey) or an alignment mark (Align Mark) on the contact surface, it is also unusable. The two alignment keys (Align key) or alignment marks (Align Mark) cannot be seen accurately, therefore, there is a problem that it is difficult to align accurately

[0009] and, if figure 1 As shown in (b), there is a method of manufacturing an alignment key (Align key) or an alignment mark (Align Mark) on the back of one of the two substrates and aligning them, but the alignment key (Align key) cannot be generated on the back of the substrate. ) or alignment mark (Align Mark) or when there are restrictions, it cannot be used, and the arrangement accuracy is low compared with the arrangement described in the description

[0010] and, if figure 1 As shown in (c), there is a method of using an IR camera to pass through two substrates and align them with an alignment key or an alignment mark on the substrate, but the resolution of the IR camera is low. Distortion and low alignment accuracy in the process of identifying the alignment key (Align key) or alignment mark (Align Mark) through the substrate

[0011] and, if figure 1 (d) As shown in the display, there is a way to arrange the alignment key (Align key) or alignment mark (Align Mark) on each substrate by using two pairs of cameras facing each other, but this method is compared with the method with the highest arrangement accuracy , has the disadvantage of low alignment accuracy

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