Wafer taking and positioning method for coating automation equipment

Abstract

The invention discloses a wafer taking and positioning method for coating automation equipment. The used coating automation equipment comprises three silicon wafer positioning cylinders and a wafer taking manipulator, wherein the three silicon wafer positioning cylinders are sequentially started in a time order in a silicon wafer positioning process; after the three silicon wafer positioning cylinders move to place positions, the second silicon wafer positioning cylinder is removed to complete silicon wafer positioning; and the wafer taking manipulator is started to complete a wafer taking process. On the premise of not changing an original mechanism, the silicon wafer is positioned with a reference point through adjusting the place positions and movement sequence of the cylinders, so thatmore accurate positioning is achieved; and meanwhile, the risk of a cracked wafer here is avoided through optimization of a wafer taking path of a suction pad of a robot and cooperation with the movement of the silicon wafer positioning cylinders.

Description

technical field [0001] The invention relates to a film picking and positioning method for automatic coating equipment. By optimizing the positioning method of silicon wafers in front of the film coating automation equipment and coordinating with the picking path of a robot, the action is optimized to achieve accurate positioning of silicon wafers and reduce the drop of graphite boats and silicon wafers. Scratches, poor printing of suction cups. Background technique [0002] At present, the positioning of silicon wafers in front of the film of Jiejia Weichuang automation equipment uses two cylinders to move simultaneously on both sides for positioning, and the third cylinder for rear side push piece positioning. The robot picks up the wafer by holding up the silicon wafer, opening the vacuum, and releasing the positioning cylinder; this positioning method has the following problems: ① There is no reference point for silicon wafer positioning (two positioning cylinders move at...

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Problems solved by technology

The robot picks up the wafer by holding up the silicon wafer, opening the vacuum, and releasing the positioning cylinder; this positioning method has the following problems: ① There is no reference point for silicon wafer positioning (two positioning cylinders move at the same time, and the cylinder that is in contact with the silicon wafer is given priority Uncertainty, so that there is no uniform positioning reference for the silicon wafer), there is a problem of large fluctuations in the position in the positioning mechanism (this kind of position fluctuation is not easy to be found as a reference problem) When starting, the two positioning cylinders are not loosened, which is likely to cause friction between the silicon wafer and the positioning mechanism), and there is a risk of cracking the silicon wafer

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