A six-phase parallel interleaved fully integrated buck circuit

Abstract

The invention belongs to the field of integrated power supplies, and in particular relates to a six-phase parallel interleaved fully integrated buck circuit, comprising: first to sixth phase inductors integrated in a packaged tube shell, first to sixth phase feedback circuits, and delay-locked phases A loop circuit, a logic circuit, and a digital-to-analog conversion circuit; the first phase feedback circuit is used to form a switch control signal through hysteresis control based on the input voltage, the reference voltage, and the current of the first phase inductance, and control the first phase inductance current; delay The phase-locked loop circuit is used to delay five different switching cycles on the basis of the switch control signal to obtain five clock signals; the logic circuit is used to convert the five clock signals into narrow pulse signals of corresponding phases and output them to the first The second to sixth phase feedback circuits regulate the six-phase inductance current in a manner of six-phase parallel connection and interleaving through hysteresis control. The circuit of the invention realizes six-phase parallel output and six-phase inductance current regulation, reduces output ripple and reduces output capacitance.

Description

technical field [0001] The invention belongs to the field of integrated power supplies, and more specifically relates to a six-phase parallel interleaved fully integrated buck circuit. Background technique [0002] With the popularity of modern system-on-chips (SOCs), the demand for high-speed, high-integration, on-chip power supplies is becoming more and more urgent. In order to realize the miniaturization of the system, it is necessary to make the power converter operate at high frequency to reduce the inductance or capacitance value of the power stage. In order to minimize the required inductance value of the converter, there are various technical options. One way is to integrate them directly on the chip, but that usually comes with a larger silicon area cost. Another approach, which can also use bond wire inductors on the package, is not implemented in silicon and has better quality factor, power efficiency and can greatly reduce cost. [0003] For a traditional sing...

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Problems solved by technology

[0005] The invention provides a six-phase parallel interleaved fully integrated buck circuit, which is used to solve the technical problem of realizing multi-phase parallel current sharing while the existing buck circuit is fully integrated in space

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