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Method for solving carbon powder residue in multilayer FPC manufacturing process based on front windowing process

A window opening process and solution technology, which is applied in the field of circuit board production, can solve the problems of limiting the application of the front window opening process and the inability to remove toner, so as to avoid the occurrence of color difference, reduce the amount of PI bite, and ensure product quality. Effect

Pending Publication Date: 2020-06-30
KINWONG ELECTRONICS TECH LONGCHUAN
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  • Description
  • Claims
  • Application Information

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Problems solved by technology

[0004] In the design of the front opening window, the outer layer of the FPC multilayer board needs black shadow treatment when electroplating, and the exposed part of the inner layer will directly contact the black shadow potion due to the window structure, resulting in the adsorption of carbon powder on the inner covering film PI and / or substrate. On the material PI, the conventional electroplating and graphic process cannot remove the residual carbon powder
This defect limits the application of the front opening process

Method used

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  • Method for solving carbon powder residue in multilayer FPC manufacturing process based on front windowing process
  • Method for solving carbon powder residue in multilayer FPC manufacturing process based on front windowing process
  • Method for solving carbon powder residue in multilayer FPC manufacturing process based on front windowing process

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Embodiment Construction

[0035] The technical solutions in the embodiments of the present invention will be clearly and completely described below in conjunction with the drawings in the embodiments of the present invention, and similar component numbers in the drawings represent similar components. Apparently, the embodiments described below are only a part of the embodiments of the present invention, rather than all the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by persons of ordinary skill in the art without creative efforts fall within the protection scope of the present invention.

[0036] It should be understood that when used in this specification and the appended claims, the terms "comprising" and "comprises" indicate the presence of described features, integers, steps, operations, elements and / or components, but do not exclude one or Presence or addition of multiple other features, integers, steps, operations, elements, components and / or col...

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Abstract

The invention discloses a method for solving carbon powder residue in a multilayer FPC manufacturing process based on a front windowing process, and relates to the technical field of circuit board production. In the multi-layer FPC manufacturing process based on front windowing design, carbon powder removing operation is added, and the problem that carbon powder is adsorbed to an inner-layer plateand is difficult to remove due to liquid medicine residues during black shadow is solved. Different processing flows and parameters are set according to different positions of carbon powder residues,and the situation that the product quality is affected due to the fact that color differences of the surface of the covering film are different is avoided. According to the manufacturing method of the multilayer FPC, based on the process design of the front window, carbon powder left in the black shadow process can be removed, the product quality is ensured, and the application range of the process design of the front window is expanded.

Description

technical field [0001] The invention relates to the technical field of circuit board production, in particular to a method for solving carbon powder residues in a multi-layer FPC manufacturing process based on a front opening process. Background technique [0002] In the 21st century, with the continuous development of electronic technology, consumers have increasingly comprehensive functional requirements for electronic products. In order to meet different functional requirements, printed circuit boards will also make corresponding adjustments in product structure. Boards are also becoming more common. [0003] In the design of FPC multilayer boards, there are often structures that need to be uncovered. The corresponding FPC manufacturing process has two different manufacturing processes: front uncovering and rear uncovering. For the front cover design, thermosetting adhesive + single-sided copper foil can be used to open the front window at the same time. In addition, the...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H05K3/26H05K3/46
CPCH05K3/26H05K3/46
Inventor 杨磊磊
Owner KINWONG ELECTRONICS TECH LONGCHUAN
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