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Ultrasonic friction imprinting method and device for polymer device

A thermoplastic polymer, device technology, applied in the direction of coatings, etc., can solve the problems of burrs, bulges, destructive effects of base materials, etc.

Pending Publication Date: 2020-07-03
TIANJIN UNIV OF TECH & EDUCATION TEACHER DEV CENT OF CHINA VOCATIONAL TRAINING & GUIDANCE
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  • Abstract
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  • Claims
  • Application Information

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Problems solved by technology

[0002] The current ultrasonic imprinting is longitudinal wave vibration, through which the thermoplastic polymer is melted to achieve imprinting, but due to the incompressibility of the polymer material, defects such as burrs and bumps will occur after the extrusion is completed, and the longitudinal vibration will affect the substrate. Destructive effects inside the material

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  • Ultrasonic friction imprinting method and device for polymer device

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Embodiment Construction

[0021] The specific implementation manners of the present invention will be further described in detail below in conjunction with the accompanying drawings and embodiments. The following examples are used to illustrate the present invention, but are not intended to limit the scope of the present invention.

[0022] The technical solutions of the present invention will be clearly and completely described below in conjunction with the accompanying drawings. Apparently, the described embodiments are some of the embodiments of the present invention, but not all of them. Based on the embodiments of the present invention, all other embodiments obtained by persons of ordinary skill in the art without making creative efforts belong to the protection scope of the present invention. In addition, the technical features involved in the different embodiments of the present invention described below may be combined with each other as long as there is no conflict with each other.

[0023] S...

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Abstract

The invention relates to an ultrasonic friction imprinting method and device for a thermoplastic polymer device. The method comprises the steps that a micro-feeding system detects that a mold and a thermoplastic polymer reach a critical inlet and outlet state; pressure is applied to the thermoplastic polymer through the micro-feeding system; an ultrasonic device arranged on the side surface of thethermoplastic polymer device is started before, during or after any one of the steps, wherein the ultrasonic frequency emitted by the ultrasonic device is 200 Hz-40 KHz; data of a temperature field and a stress-strain field in the thermoplastic polymer imprinting process are detected through the micro-feeding system; pressure of the micro-feeding system is maintained for a certain period of time;the ultrasonic device is stopped; and demolding is carried out. Through the friction effect of transverse ultrasonic vibration, the surface temperature of the polymer and the surface temperature of the mold are increased, the polymer is molten, then impressing of a micro-nano structure is achieved under the pressure effect, and moreover, the transverse vibration does not affect an internal structure of the thermoplastic polymer device.

Description

technical field [0001] The invention relates to an embossing device and a control method for thermoplastic polymer devices, belonging to the field of microfluidic chips. Background technique [0002] The current ultrasonic embossing is longitudinal wave vibration, through which the thermoplastic polymer is melted to achieve embossing, but due to the incompressibility of polymer materials, defects such as burrs and bumps will occur after the extrusion is completed, and the longitudinal vibration will affect the substrate. Destructive effects inside the material. Contents of the invention [0003] The technical problem to be solved by the invention is: the problem of burrs and bulges in thermoplastic polymer caused by longitudinal wave vibration. [0004] In order to solve the above technical problems, the present invention adopts the following technical solution: an ultrasonic friction embossing method for thermoplastic polymer devices, the method comprising: [0005] The...

Claims

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Application Information

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IPC IPC(8): B29C59/02B29C37/00B29C33/42B29C35/02
CPCB29C33/42B29C35/0255B29C35/0261B29C37/00B29C59/002B29C59/022B29C2037/90B29C2059/023
Inventor 崔良玉胡高峰韩建鑫靳刚李占杰
Owner TIANJIN UNIV OF TECH & EDUCATION TEACHER DEV CENT OF CHINA VOCATIONAL TRAINING & GUIDANCE
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