Capping and uncapping equipment for chip coating

A chip and equipment technology, applied in the field of cap closing and dismantling equipment, can solve problems such as inaccurate positioning, untimely detection of fixture problems, batch NG problems, etc., to achieve convenient and simple cap closure and cap disassembly, and convenient connection to the Internet of Things , precise positioning effect

Inactive Publication Date: 2020-07-10
HIMIT (SHENZHEN) TECH CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0002] In the technical process of chip coating, the chip needs to be clamped and then cleaned. After cleaning, the chip needs to be taken out. The existing clamping method is inaccurate in positioning, low in efficiency, and many steps need to be performed manually; When there is a problem with the clamping fixture, it cannot be found in time, and it is also difficult to track. It can only be checked one by one, which is prone to batch NG problems

Method used

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  • Capping and uncapping equipment for chip coating
  • Capping and uncapping equipment for chip coating
  • Capping and uncapping equipment for chip coating

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0043] See Figure 1-Figure 11 , a capping and decapping equipment for chip coating, including a capping part and a decapping part, wherein,

[0044] The cover-closing part includes: a code-closing code-scanning mechanism for scanning the PCBA board, the cover plate and the fixture respectively, and a first handling manipulator, which sequentially sucks the PCBA board, the cover plate , and then assemble the PCBA board and the cover plate in the jig after being adjusted by a visual mechanism;

[0045] The cover removal part includes: a cover removal mechanism that disassembles the processed lid product; a cover scanning code scanning mechanism that scans the disassembled PCBA board, cover plate and jig; and is used to pick up The disassembled cover plate and the second handling manipulator of the PCBA board.

[0046] The PCBA board, cover plate and jig are respectively scanned by the cover scanning mechanism, and the visual mechanism is used to assist the first handling mani...

Embodiment 2

[0063] A cover and cover removal equipment for chip coating, including a code scanning mechanism, a handling manipulator, a PCBA board feeding track, a jig track, a cover track, a jig hopper, a cover hopper, a visual mechanism, and a cover removal Mechanism and handling manipulator; in the cover-closing process, the jigs in the jig silo are transported by the jig track and arrive at a predetermined position after being scanned by the code scanning mechanism, and the PCBA board feeding track provides The PCBA board is scanned by the code-scanning mechanism, picked up by the handling manipulator, and arranged in the jig that reaches the predetermined position with the assistance of the vision mechanism. The cover plate in the cover plate bin passes through the The cover plate is transported by track, and the scanning mechanism is picked up by the handling manipulator after scanning the code, and with the assistance of the vision mechanism, the PCB board is sandwiched with the jig...

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Abstract

The invention relates to capping and uncapping equipment for chip coating. Capping and uncapping are convenient and simple, accurate positioning can be ensured through detection of a visual mechanism,the numbers of a PCBA plate, a cover plate and a jig can be completely recorded through matching with a capping code sweeping mechanism and an uncapping code sweeping mechanism, timely positioning and tracking are carried out to avoid large-batch NG products when problems occur, and the equipment can be conveniently connected with an Internet of Things.

Description

technical field [0001] The invention relates to the technical field of chip coating, in particular to a cover closing and removing device for chip coating. Background technique [0002] In the technical process of chip coating, the chip needs to be clamped and then cleaned. After cleaning, the chip needs to be taken out. The existing clamping method is inaccurate in positioning, low in efficiency, and many steps need to be performed manually; When there is a problem with the clamping fixture, it cannot be found in time, and it is also difficult to track. It can only be checked one by one, which is prone to batch NG problems. Contents of the invention [0003] In view of the above situation, it is necessary to provide a cap-closing and de-capping device for chip coating that is convenient for chip clamping and cleaning. [0004] In order to solve the above-mentioned technical problems, the technical solution adopted in the present invention is: a cover-closing and uncappin...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): B23P19/00H01L21/67
CPCB23P19/00B23P19/001H01L21/67
Inventor 蒋海兵
Owner HIMIT (SHENZHEN) TECH CO LTD
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