Cooling fin, controller and air conditioner

Abstract

The invention provides a cooling fin, a controller and an air conditioner. The cooling fin comprises a base plate and a plurality of fins connected to the first side of the base plate. The second sideof the base plate is used for being in contact connection with a heat source component, wherein the second side and the first side are oppositely arranged, the second side is provided with a first area corresponding to a contact connection surface of the heat source component and a second area located outside the first area; and the thickness of the base plate corresponding to the first area is smaller than that of the base plate corresponding to the second area. According to the cooling fin, the controller and the air conditioner, through regional design of the thickness of the cooling fin base plate, fin heat dissipation of the cooling fin is effectively utilized and the heat dissipation effect of the cooling fin is improved, and the structure is compact.

Description

technical field [0001] The invention belongs to the technical field of air conditioning, and in particular relates to a radiator, a controller and an air conditioner. Background technique [0002] The heat sink often has local high temperature during the heat dissipation process, which leads to high pressure around the fin in the high temperature area, and it is difficult for the external cooling heat exchange air to flow into the high temperature area, so that the heat transfer efficiency in the high temperature area is low. However, due to the small temperature difference between the fin and the substrate, it cannot achieve a good heat transfer effect, and the heat dissipation utilization rate of the fin is low. In order to overcome the aforementioned shortcomings, one way is: when selecting the existing heat sink The design maximum heat transfer is far greater than the corresponding heat load, which leads to a large selection of heat sink; another way is to design and int...

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Problems solved by technology

[0002] The heat sink often has local high temperature during the heat dissipation process, which leads to high pressure around the fin in the high temperature area, and it is difficult for the external cooling heat exchange air to flow into the high temperature area, so that the heat transfer efficiency in the high temperature area is low. However, due to the small temperature difference between the fin and the substrate, it cannot achieve a good heat transfer effect, and the heat dissipation utilization rate of the fin is low. In order to overcome the aforementioned shortcomings, one way is: when selecting the existing heat sink The design maximum heat transfer is far greater than the corresponding heat load, which leads to a large selection of heat sink; another way is to design and integrate other cooling and heat dissipation methods on the heat sink, such as adding cooling pipes, etc. The method of adding components to the heat sink for integration also makes the overall structure of the heat sink too large and the structure becomes complicated. In view of this situation, the present invention is proposed

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