Semiconductor package

Abstract

A semiconductor package is provided. The semiconductor package includes an interconnect structure, a semiconductor die formed over the interconnect structure, an encapsulating layer formed over the interconnect structure to cover and surround the semiconductor die, and an interposer structure formed over the encapsulating layer. The interposer structure includes an insulating base having a first surface facing the encapsulating layer, and a second surface opposite the first surface. The interposer structure includes island layers arranged on the first surface of the insulating base and corresponding to the semiconductor die. A portion of the encapsulating layer is sandwiched by at least two of the island layers. Alternatively, the interposer structure includes a passivation layer coveringthe second surface of the insulating base and having a recess that is extended along a peripheral edge of the insulating base.

Description

technical field [0001] Embodiments of the present invention relate to a semiconductor packaging technology, and in particular to a semiconductor package with an interposer structure. Background technique [0002] Semiconductor devices are used in various electronic applications such as personal computers, cell phones, digital cameras, and other electronic devices. Semiconductor devices are generally manufactured by sequentially depositing insulating or dielectric layers, conductive layers, and semiconductor material layers on a semiconductor substrate, and patterning the various material layers using lithography and etching processes to form circuits thereon parts and components. [0003] The semiconductor integrated circuit (IC) industry has experienced rapid growth. With the development of semiconductor technology, semiconductor chips / die become smaller and smaller. Therefore, packaging of semiconductor chips becomes more difficult, which adversely affects packaging yie...

AI Technical Summary

Problems solved by technology

[0005] However, as device sizes continue to decrease, it becomes more difficult to process and other issues arise that need to be addressed

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