Thermoelectric module suitable for non-airtight packaging and manufacturing method thereof

Abstract

The invention relates to a thermoelectric module suitable for non-airtight packaging and a manufacturing method thereof. The thermoelectric module comprises an upper substrate, a lower substrate, a galvanic couple pair and flow deflectors welded with a semiconductor element and fixedly arranged on the inner sides of the upper substrate and the lower substrate, wherein the lower substrate comprisesa galvanic couple pair area and a wiring area, the wiring area is provided with a wiring bonding pad, the upper substrate is arranged on the galvanic couple pair area, and the flow deflectors exposedin the air in the galvanic couple pair area of the upper substrate and the lower substrate and the surfaces of galvanic couple pairs are plated with protective layers. The manufacturing method comprises the steps of flow deflector sintering, galvanic couple pair welding, paraffin smearing, protective film plating and paraffin removing. The thermoelectric module has the advantages that the thermoelectric module is provided with the protective film to prevent water vapor or condensed water in air from corroding semiconductor particles and flow deflectors of the thermoelectric module and avoid short circuit, so the whole thermoelectric module can work normally in a non-airtight or even high-temperature and high-humidity environment; and a diversion trench is arranged to facilitate outflow ofcondensed water in the upper and lower substrates and prevent the condensed water from affecting the performance of the thermoelectric module.

Description

technical field [0001] The invention relates to the field of thermoelectric modules, in particular to a thermoelectric module suitable for non-airtight packaging and a manufacturing method thereof. Background technique [0002] Thermoelectric modules are generally composed of upper and lower substrates, deflectors and semiconductor elements. Its working principle is to use the Peltier effect. heat and heating needs. When the thermoelectric module is used for cooling or heating, due to the existence of condensed water, the thermoelectric module often needs to be hermetically sealed to avoid short circuit of the thermoelectric module. [0003] With the development of society, the demand for various communications is increasing, and its huge usage and low cost requirements have given birth to new product forms, such as COB, non-airtight BOX packaging, and non-traditional hermetic packaging. Products in various forms have been launched one after another, and the requirements f...

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Problems solved by technology

[0004] This invention mainly solves the problem that condensed water or high-humidity environment will cause short circuit of thermoelectric modules and needs airtight packaging, and provides a non-airtight environment, Thermoelectric module suitable for non-hermetic packaging unaffected by condensation water and high humidity environment and manufacturing method thereof

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