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Wire saw device and wafer manufacturing method

A technology of wire saws and wafers, which is applied in manufacturing tools, fine working devices, semiconductor/solid-state device manufacturing, etc., and can solve problems such as workpiece warping

Active Publication Date: 2020-07-14
SHIN-ETSU HANDOTAI CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0003] In addition, warping occurs in the severed workpiece due to the cuts made by the wire saw

Method used

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  • Wire saw device and wafer manufacturing method
  • Wire saw device and wafer manufacturing method
  • Wire saw device and wafer manufacturing method

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Embodiment Construction

[0030] As described above, in the past, a method of controlling the warpage of the wire movement direction of the cut workpiece in the wire saw device has not been determined.

[0031] The inventors of the present invention have repeatedly actively studied the above-mentioned problems and found that by adjusting the parallelism of the axis of the wire guide portion, the wire can be bent in the front-rear direction of the wire saw device during workpiece cutting. In addition, it was found that the warpage in the moving direction of the wire of the workpiece after cutting can be controlled by this, and the present invention was completed.

[0032] Hereinafter, the wire saw device and the wafer manufacturing method of the present invention will be described in detail with reference to the drawings, but the present invention is not limited thereto. In addition, in the present invention, "parallelism (parallelism adjustment amount)" refers to the amount of inclination of the axis in the...

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PUM

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Abstract

This wire saw device comprises: a plurality of wire guides; a wire row that is formed by a wire wound onto the plurality of wire guides and travels reciprocally in the axial direction; a nozzle that supplies coolant or slurry to the wire; a workpiece holding part that suspends and holds, via a beam, a workpiece plate on which a workpiece is attached; and a workpiece feeding mechanism that pressesthe workpiece against the wire row. The wire saw device is characterized by being provided with a mechanism for adjusting the degree of parallelism of the axes of the plurality of wire guides formingthe wire row. Due to this configuration, a wire saw device and a wafer manufacturing method are provided with which the warp of the workpiece in the wire movement direction after cutting is controlledand a wafer having any warp shape can be manufactured.

Description

Technical field [0001] The invention relates to a wire saw device and a method for manufacturing a wafer. Background technique [0002] Semiconductor wafers such as silicon wafers pass Picture 8 A cutting device such as the wire saw device 101 shown cuts out a workpiece such as a silicon ingot. Generally speaking, the wire saw device 101 includes a metal wire row 104 formed by a metal wire 102 that is wound around a plurality of wire guide portions 103 and moves back and forth in an axial direction. Further, the wire saw device 101 includes a nozzle 108 that supplies the slurry 109 to the wire 102, a workpiece holding portion 107 that suspends and holds the workpiece plate 106 to which the workpiece W is bonded via the beam 105, and presses the workpiece W relatively while holding it. The workpiece feeding mechanism 110 pressed to the metal line 104. With such a wire saw device 101, the workpiece W can be pressed to the metal wire array 104 and the workpiece W can be cut into a...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H01L21/304B24B27/06B28D5/04
CPCB24B27/0633B28D5/045Y02P70/10B28D5/042H01L21/304B24B27/06
Inventor 水岛一寿大高敏昭榎本辰男清水裕一
Owner SHIN-ETSU HANDOTAI CO LTD
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