3results about How to "Control warping" patented technology

The invention discloses an injection molding process for a plastic part of an air purifier, and relates to the technical field of injection molding processes. Multi-area dynamic mold temperature adjustment is performed, a plurality of temperature control areas are divided according to the thin wall and curved surface structure characteristics of the plastic part, the temperature is adjusted in real time, stress concentration and deformation are remarkably reduced, and the service life of the plastic part is prolonged. The problem of shrinkage stress of a thin-wall area is solved in a targeted mode, cooling of a thick area is accelerated, meanwhile, real-time temperature control and deformation compensation are controlled in a linkage mode, the temperature and the cooling rate are dynamically adjusted according to deformation data monitored in real time, and the deformation trend is predicted, so that pre-deformation compensation is provided, warping of the thin-wall area and the curved surface area is controlled, and deformation of the thin-wall area and the curved surface area is controlled. The stability of the plastic part in the forming process is kept, and the product precision is improved; in addition, simulation prediction and mold parameter adjustment are carried out, cooling requirements of different areas are adjusted, the temperature difference between the thin wall and the curved surface area is reduced, and the whole cooling process is more efficient.

The invention discloses a fan-out packaging integrated heat dissipation structure, and relates to the technical field of semiconductor packaging. The structure comprises at least one chip which is arranged in a mold; the rewiring layer is arranged below the chip and the molding; the solder ball is arranged below the rewiring layer; a first thermal interface layer disposed on the top of the mold; and the integrated radiator is arranged on the first thermal interface layer. According to the fan-out type package integrated heat dissipation structure provided by the invention, the integrated radiator is directly attached to the fan-out type package to enhance heat dissipation of the top passage, so that the requirements of increased power density and heat flux density on heat dissipation performance are met. Molding of the structure can protect the chip, control warping and play a role in supporting the integrated radiator.

This invention discloses a three-dimensional integrated packaging structure and fabrication method of a glass core TGV panel with embedded heterogeneous chips. The upper and lower redistribution layers of the glass core are vertically interconnected through several metal vias. The glass core layer is provided with dry cavities, and several electronic components are embedded in the glass core layer along the Z-axis through these cavities. The electronic components are horizontally wired and transmit signals through the upper and lower redistribution layers, and are electrically connected to external circuits through the upper and lower redistribution layers and metal vias. This invention integrates the cost advantages of large-size glass panels, the performance advantages of glass materials, the vertical interconnection advantages of TGV, the density advantages of embedded packaging, and thermal management technology. It addresses the shortcomings of current packaging technologies in terms of high performance, high integration, low cost, and excellent heat dissipation, providing a system-level packaging solution with superior overall performance. This solution can improve system performance, heat dissipation performance, and integration, while reducing costs.