Epoxy resin composition suitable for fan-out wafer level package

A technology of wafer-level packaging and epoxy resin, which is applied in the direction of electrical components, circuits, and electrical solid devices, and can solve problems such as insufficient fluidity under high filling volumes
CN107216614AActive Publication Date: 2017-09-29JIANGSU HHCK NEW MATERIAL CO LTD
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Patent Information

Authority / Receiving Office
CN · China
Patent Type
Applications(China)
Current Assignee / Owner
JIANGSU HHCK NEW MATERIAL CO LTD
Publication Date
2017-09-29

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Abstract

The invention discloses an epoxy resin composition suitable for fan-out wafer level package. The epoxy resin composition is prepared from the following main components of epoxy resin, silica powder, curing agent and flow aid, wherein the content of the silica powder accounts for 89 to 93 percent of the total mass of the epoxy resin composition; the curing agent is one or a mixture of components shown in a formula (1) and a formula (2), and accounts for 3 to 8 percent of the total mass of the epoxy resin composition; the epoxy resin is shown as a formula (3), and accounts for 2 to 6 percent of the total mass of the epoxy resin composition; the flow aid is a methoxyl-containing organic silicon resin which accounts for 0.5 to 1 percent of the total mass of the epoxy resin composition. The epoxy resin composition can further contain a proper amount of catalyst, coloring agent, demolding agent, ion catching agent, coupling agent, stress absorbent and the like. The epoxy resin composition has the advantages that the glass transition temperature is remarkably raised, and the bending modulus is lowered. The problems of warping and insufficient liquidity under a large filling amount can be solved, so that continuous production can be realized by using a conventional extruder of the epoxy resin composition.
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Description

technical field

[0001] The invention relates to an epoxy resin composition, in particular to an epoxy resin composition suitable for fan-out wafer level packaging. Background technique

[0002] Since the variation of package size is much larger than that of chip size, fan-out wafer-level packaging (FOWLP) technology has attracted more attention from the industry. With this technology, chips with a larger number of terminals can be packaged without reducing the pitch, and there is no need to change the package size even if the chip shrinks. Therefore, FOWLP can realize the standardization of packaging size, and can realize the mixed packaging of multiple chips (which can be different types of chips).

[0003] The biggest technical feature of FoWLP packaging is that it does not require the use of a printed circuit board (PCB), plus the advantages of flexible expansion of I / O Port and small packaging area, which can greatly reduce production costs and improve performance. FoW...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
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