A large size ceramic substrate

A ceramic substrate, large-scale technology, applied in the direction of resistance manufacturing, resistors, electrical components, etc., can solve the problems of low production efficiency, achieve the effects of increasing production efficiency, improving warpage, and controlling warpage

Active Publication Date: 2022-07-12
NANCHONG THREE CIRCLE ELECTRONICS +1
View PDF0 Cites 0 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

The ceramic substrate provided by the invention can reduce warpage, and solve the problem of low production efficiency in the current application of ceramic substrates to chip resistors

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Image

Smart Image Click on the blue labels to locate them in the text.
Viewing Examples
Smart Image
  • A large size ceramic substrate
  • A large size ceramic substrate
  • A large size ceramic substrate

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0083] 1. Put the alumina powder and the flux into the ball mill in a certain proportion, wherein the proportion of the alumina powder in the solid phase component is 95wt%, and the flux component is SiO 2 -MgO-CaO, the ratio of which is 1.5:0.8:0.4, and the addition amount is 5wt%. Then add additives and solvent into the ball mill to prepare slurry. The additives mainly include the binder PVB and the plasticizer DBP. The addition amount of the additives is relative to 100wt% of the solid phase component. The addition amount of the binder PVB is 5wt% and the plasticizer DBP is 5wt%. The amount of the solvent is 50% of the mass of the powder (alumina powder and flux), and the mass ratio of toluene and isopropanol in the solvent is 6:11.

[0084] 2. Casting molding: The slurry prepared above is uniformly coated on a smooth transmission PET release film through the casting nozzle, and dried in an oven to form a green body with a certain thickness, density and uniformity.

[008...

Embodiment 2

[0091] The only difference between this example and Example 1 is that the addition amount of the binder PVB is 6 wt %, and the rest is the same as that of Example 1.

Embodiment 3

[0093] The only difference between this example and Example 1 is that the addition amount of the binder PVB is 8 wt %, and the rest is the same as that of Example 1.

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to view more

PUM

PropertyMeasurementUnit
depthaaaaaaaaaa
depthaaaaaaaaaa
lengthaaaaaaaaaa
Login to view more

Abstract

The invention discloses a large-sized ceramic substrate. This large-sized ceramic substrate includes a ceramic substrate body; a sheet-forming area, which is arranged on the surface of the ceramic substrate body; a white edge, which is arranged around the sheet-forming area; the sheet-forming area is provided with There are several primary dents and secondary dents formed on the surface of the ceramic substrate body; the primary dents and the secondary dents intersect vertically; the depth of the primary dents is greater than the depth of the secondary dents; The outer dimensions of the ceramic substrate are as follows: length≥89.60mm, width≥79.60mm, thickness≥0.43mm. The invention greatly increases the production efficiency of the substrate by increasing the length and width of the ceramic substrate, and can effectively control the occurrence of warpage, which is conducive to large-scale automatic production and reduces the cost of materials, labor and time.

Description

technical field [0001] The invention relates to the technical field of ceramic substrates, in particular to a large-sized ceramic substrate. Background technique [0002] SMD Resistor refers to a resistor made by printing electronic paste containing a mixture of metal powder and glass glaze powder on a ceramic substrate. Can adapt to reflow soldering and wave soldering; high reliability, good frequency characteristics, low electromagnetic and radio frequency interference; easy to achieve automatic production and other advantages. [0003] Chip resistors are widely used in high-end computers, industrial equipment, automatic control equipment, medical equipment, high-tech multimedia electronic equipment and other fields because of their excellent performance. In recent years, with the rapid economic growth, the annual demand for sheet resistors at home and abroad has also increased year by year, and the large-scale market demand has put forward higher requirements for the pro...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to view more

Application Information

Patent Timeline
no application Login to view more
Patent Type & Authority Patents(China)
IPC IPC(8): H01C7/00H01C17/00
CPCH01C7/00H01C17/00
Inventor 孙健黄雪云王高强
Owner NANCHONG THREE CIRCLE ELECTRONICS
Who we serve
  • R&D Engineer
  • R&D Manager
  • IP Professional
Why Eureka
  • Industry Leading Data Capabilities
  • Powerful AI technology
  • Patent DNA Extraction
Social media
Try Eureka
PatSnap group products