Temperature field and deformation field synchronous measurement device and method

A technology of simultaneous measurement and deformation field, which is applied in the field of material experiments, can solve the problems of inaccurate measurement results of temperature field and deformation field, and achieve the effect of wide applicability and high accuracy

Active Publication Date: 2020-07-17
TSINGHUA UNIV
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  • Description
  • Claims
  • Application Information

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Problems solved by technology

[0004] In view of this, the present disclosure proposes a temperature field and deformation field synchronous measurement device and method, which are used to solve the problem of inaccurate measurement results of temperature field and deformation field due to crosstalk between optical channels in prior art measurement methods

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  • Temperature field and deformation field synchronous measurement device and method
  • Temperature field and deformation field synchronous measurement device and method
  • Temperature field and deformation field synchronous measurement device and method

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Embodiment Construction

[0038] Various exemplary embodiments, features, and aspects of the present disclosure will be described in detail below with reference to the accompanying drawings. The same reference numbers in the figures indicate functionally identical or similar elements. While various aspects of the embodiments are shown in drawings, the drawings are not necessarily drawn to scale unless specifically indicated.

[0039] The word "exemplary" is used exclusively herein to mean "serving as an example, embodiment, or illustration." Any embodiment described herein as "exemplary" is not necessarily to be construed as superior or better than other embodiments.

[0040] In addition, in order to better illustrate the present disclosure, numerous specific details are given in the following specific implementation manners. It will be understood by those skilled in the art that the present disclosure may be practiced without some of the specific details. In some instances, methods, means, componen...

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Abstract

The invention relates to a temperature field and deformation field synchronous measurement device and method. The device comprises: an illumination module used for irradiating a to-be-measured objectthrough a light source; an image acquisition module which is used for acquiring a first image and a second image of the to-be-measured object under the irradiation of the lighting module through the light source; an image processing module which is connected to the illumination module and the image acquisition module and is used for correcting the crosstalk amount of each channel of the first image and the second image to determine a third image and a fourth image; an image processing module which is also used for determining a temperature field of the to-be-measured object according to the gray value of the first image channel of the fourth image and the reference temperature of the to-be-measured object; and an image processing module which is also used for determining the deformation field of the to-be-measured object according to the gray values of the second image channels of the third image and the fourth image. By means of the device, the accuracy of calculation results of the temperature field and the deformation field can be higher.

Description

technical field [0001] The present disclosure relates to the technical field of material experimentation, in particular to a device and method for synchronously measuring a temperature field and a deformation field. Background technique [0002] In aerospace, gas turbine and other fields, many key structural components face the test of high temperature and complex environment under service conditions. The measurement and evaluation of key parameters and physical quantities in high-temperature complex environments is of great significance for guiding material selection, component design, and structural optimization. According to the measurement form, the measurement methods in high temperature environment can be divided into two categories: contact type and non-contact type. [0003] Existing contact measurement methods have high requirements on components, which limits the application of contact measurement methods in high temperature environments. In addition, existing no...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): G06T7/90G06T7/00G06T5/00G01D21/02
CPCG01D21/02G06T5/006G06T7/90G06T7/97
Inventor 冯雪岳孟坤张金松屈哲唐云龙方旭飞
Owner TSINGHUA UNIV
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