Ultrasound scanner assembly

An ultrasonic scanning, ultrasonic transducer technology, applied in ultrasonic/sonic/infrasonic diagnosis, sensors, ultrasonic/sonic/infrasonic Permian technology, etc., can solve problems such as small size and unreliable connection

Active Publication Date: 2020-07-17
KONINKLJIJKE PHILIPS NV
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, due to the small size of the solder joints used to mount electronic components to flex circuits, voids or unreliable connections have been observed at the solder joints
Additionally, stencil printing requires precise alignment control and has limited scope in terms of the amount of solder paste that can be printed onto the contact pads of the flex circuit

Method used

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Examples

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Embodiment Construction

[0019] To promote an understanding of the principles of the disclosure, reference will now be made to the embodiments illustrated in the drawings and specific language will be used to describe them. Nevertheless, it should be understood that no limitation of the scope of the present disclosure is intended. Any alterations and further modifications of the described apparatus, apparatus, methods, and any further applications of the principles of the disclosure are fully contemplated as would normally occur to one skilled in the art of the disclosure. In particular, it is fully envisioned that features, components and / or steps described with respect to one or more embodiments may be combined with features, components and / or steps described with respect to other embodiments of the disclosure. For simplicity, in some instances, the same reference numbers will be used throughout the drawings to refer to the same or like parts.

[0020] figure 1is a diagrammatic illustration of an ...

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Abstract

Intraluminal ultrasound imaging device, systems and methods are provided. In some embodiments, the intraluminal ultrasound imaging device includes a flexible elongate member configured to be positioned within a body lumen of a patient, and an ultrasound scanner assembly disposed at a distal portion of the flexible elongate member and configured to obtain imaging data of the body lumen. The ultrasound scanner assembly includes a flexible substrate, a first under-bump metallization (UBM) layer over the flexible substrate, a first solder feature over the first UBM layer, and a first electronic component electrically connected to the first solder feature.

Description

[0001] related application [0002] This application claims the benefit and priority of US Provisional Application US 62 / 579204, filed October 31, 2018, which is incorporated herein by reference. technical field [0003] The present disclosure relates generally to intraluminal and / or intravascular ultrasound (IVUS) imaging systems, and in particular to ultrasound scanner assemblies with plated solder bumps. Electroplated solder bumps reduce or eliminate the use of solder balls and improve process yield and reliability of the ultrasonic scanner assembly. Background technique [0004] Medical professionals commonly use minimally invasive sensing systems to evaluate, measure, and diagnose conditions within the human body. As one example, intravascular ultrasound (IVUS) imaging is widely used in interventional cardiology as a diagnostic tool for evaluating diseased blood vessels (e.g., arteries) in the human body to determine the need for treatment, guide intervention and / or as...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): B06B1/06A61B8/08
CPCA61B8/0891A61B8/12A61B8/445A61B8/4461A61B8/4483B06B1/0292B06B1/0622B06B1/0633H05K1/189H05K3/388A61B2562/12A61B2562/227B06B2201/76H05K2201/0145H05K2201/0154H05K2201/056H05K2201/10151H05K3/305H05K3/3421
Inventor J·宋
Owner KONINKLJIJKE PHILIPS NV
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