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Broken wiring repair process

A wiring and process technology, applied in the field of wiring disconnection repair process, can solve the problems of no contact with the metal layer of the substrate, failure of disconnection repair, excessive damage, etc., and achieve the effect of good conductivity and ideal filling effect.

Pending Publication Date: 2020-07-24
林杰
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0006] For this reason, the embodiment of the present invention provides a wiring disconnection repair process to solve the problem in the prior art when wiring on the Zap Hole due to the excessive damage caused by the nano-cutting laser on both sides of the metal layer of the product when making the Zap Hole. , the silver ink solution cannot touch the metal layer of the substrate because it cannot penetrate into the damaged gap, resulting in the failure of disconnection repair

Method used

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Embodiment 1

[0027] Such as image 3 As shown, the embodiment of the present invention provides a wiring disconnection repair process, including:

[0028] Based on the vapor deposition method, in the damage gap 1 caused by excessive laser damage on the metal layers on both sides of the Zap Hole (repair hole) in the substrate, a tungsten conductive film for connecting the metal layer of the substrate is selectively formed, and the tungsten Conduct EHD-silver ink wiring on the conductive film.

[0029] Specifically, a nanoscale cutting laser is first selected, and a cutting laser is emitted on the insulating layer at the top of the broken line of the substrate to make a Zap Hole, so that the two sides of the Zap Hole include the Metal2 insulating layer 2 and the Metal2 metal layer 3 exposed from the top to the bottom in sequence. (Al+Co) and G.IN insulation layer 4, wherein the nanoscale cutting laser is the nanoscale cutting laser that comes with LCVD laser repair, and the cutting laser fo...

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Abstract

The embodiment of the invention discloses a broken wiring repair process.. The process comprises the steps of selectively forming a tungsten conductive film used for connecting a substrate metal layerin a damage gap caused by excessive laser damage on metal layers on two sides of a Zap Hole in a substrate based on a vapor deposition principle, and performing EHD-silver ink wiring on the tungstenconductive film. According to the invention, an existing Zap + INK Wire process (a wiring process of repairing holes and printing ink) is improved into a Zap + W (tungsten) Contact(Wiring Type) + INKWiring process (a wiring process of repairing holes, tungsten films (fixed-point deposition) and printing ink); metal tungsten is added between an existing Zap Hole metal layer and an INK Wiring metallayer to serve as a conductive medium; therefore, under the condition that the surface of the Zap Hole is completely covered by the tungsten metal layer, the filling effect of the silver ink solutionis very ideal; the silver ink solution can be completely attached to the upper portion of the tungsten metal layer after the liquid curing reaction of the silver ink solution is finished; and it is guaranteed that in the Ag wiring process, silver and the metal layer below a substrate insulating layer are good in conductivity in the welding process.

Description

technical field [0001] Embodiments of the present invention relate to the technical field of display panels, and in particular to a wiring disconnection repair process. Background technique [0002] At present, EHD Ag INK Repair (EHD-Silver Ink Repair) technology is widely used in Array Inline Wiring Repair (Array Inline Wiring Repair) of major panel factories all over the world, using the low resistance characteristics of silver to create high-end panel products. However, this technology cannot be applied to Array Final Wiring Repair (array final wiring repair), because it is necessary to use Cutting Laser (cutting laser) to create a Zap Hole (repair hole) in the top insulating layer before performing Ag wiring to ensure that Ag It is welded to the metal layer below the insulating layer to ensure electrical conductivity. [0003] The laser repair equipment of most panel factories is equipped with nano-level Cutting Laser (cutting laser), its emission frequency is not highe...

Claims

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Application Information

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IPC IPC(8): H01L21/48G09F9/30G02F1/1362
CPCH01L21/485G09F9/30G02F1/136259G02F1/136263
Inventor 林杰
Owner 林杰