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A technology for encapsulating the main body and electrode pads, which can be used in circuit devices, emergency protection circuit devices, emergency protection circuit devices for limiting overcurrent/overvoltage, etc., and can solve problems such as accidental short circuits

Pending Publication Date: 2020-07-24
NGK SPARK PLUG CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0004] However, in order to meet the demand for miniaturization of the package, when the pair of internal electrodes having a height of 30 μm or more are arranged adjacent to each other on the bottom surface of the inside (cavity) of the package base, due to Since electronic components are mounted over the pair of internal electrodes, bonding materials such as solder disposed on each of the internal electrodes may come into contact with each other and cause an inadvertent short circuit.

Method used

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Embodiment Construction

[0046] Hereinafter, the form for carrying out this invention is demonstrated.

[0047] Fig. 1(A) is a top view showing a package 1a according to one form of the present invention, Fig. 1(B) is a vertical sectional view taken along line BB in Fig. 1(A), and Fig. 1(C) is a vertical sectional view along The vertical sectional view of the line CC in Fig. 1(A).

[0048] Such as Figure 1(A) ~ Figure 1(C) As shown, the above-mentioned package 1a is provided with: a package body 2a, which has a plate shape as a whole; a pair (plurality) of recesses 10, which are opened on the surface 3 of the package body 2a and are adjacent to each other in plan view; and a pair of electrodes Pads 12 are respectively arranged on the bottom surface of each recess 10 .

[0049] The above-mentioned package body 2a is formed by laminating two upper and lower ceramic layers (insulating layers) c1 and c2, and has: a surface 3, which has a rectangular shape (rectangular shape) when viewed from above; and...

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Abstract

The present invention provides a package in which, even when a plurality of electrode pads are disposed adjacent to each other on the surface of a package body formed of a plurality of insulating layers, a short circuit does not easily occur between the electrode pads when an electronic component to be mounted is mounted to a mounting portion included in the surface. The package (1a) is provided with: a package body (2a) in which a plurality of ceramic layers (insulating layers) (c1, c2) are laminated, the package body (2a) having a front surface (3), a rear surface (4) facing the front surface, and a side surface (5) positioned between the front surface and the rear surface, the front surface including a mounting section (6) for an electronic component (7); a pair of recesses (10) that are adjacent to each other and open to the surface of the body; and a plurality of electrode pads (12) which are respectively disposed on the bottom surface of each of the recesses, the surfaces of theelectrode pads being lower than the surface of the package body, and the electrode pads being electrically connected to conductor layers (16, 17) formed on the back surface and the side surfaces of the package body.

Description

technical field [0001] The present invention relates to a package having an electronic component mounting portion on the surface of a package body formed by laminating a plurality of insulating layers, and connecting and mounting external connection terminals of the electronic component on the surface adjacent to each other. When a plurality of electrode pads are arranged adjacent to each other, it is difficult to generate a short circuit between the electrode pads. Background technique [0002] For example, a hermetic sealing package is proposed in which a pair of internal electrodes and a plurality of external electrodes are respectively connected by a plurality of conduction lines penetrating through a ceramic layer on the lower layer side, and the pair of internal electrodes are provided on a plurality of external electrodes. Ceramic layers are laminated to form the bottom surface of the inner side (cavity) of a box-shaped package base, and the plurality of external elec...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H05K1/18
CPCH05K1/182H05K1/183H01L23/13H01L23/055H01L23/49805H01L23/49827H01L2924/15156H01L2224/0401H01L2924/15313H01L2224/16237H01L2224/131H01L2224/81191H01L2224/81193H01L2924/16251H01L2924/15787H01L2924/15174H01L24/13H01L24/16H01L24/81H01L2924/014H01L2924/00014H01L23/485H01L23/528H01L24/46H01L23/49816H01L23/053H01L24/02H02H9/008H05K1/111H01L2224/05026H01L2224/05571
Inventor 宫路隆幸
Owner NGK SPARK PLUG CO LTD
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