Unlock instant, AI-driven research and patent intelligence for your innovation.

A new type of cpu liquid cooling radiator

A new type of liquid cooling technology, applied in the field of CPU heat dissipation, can solve problems such as reducing costs, and achieve the effect of reducing costs and strengthening the value of application and promotion

Active Publication Date: 2021-10-22
INSPUR SUZHOU INTELLIGENT TECH CO LTD
View PDF11 Cites 0 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0004] Aiming at the current problem that the VR air-cooled heat sink often interferes with the CPU liquid-cooled pipe, this invention provides a new type of CPU liquid-cooled radiator. chips, and reduce the cost

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Image

Smart Image Click on the blue labels to locate them in the text.
Viewing Examples
Smart Image
  • A new type of cpu liquid cooling radiator
  • A new type of cpu liquid cooling radiator
  • A new type of cpu liquid cooling radiator

Examples

Experimental program
Comparison scheme
Effect test

Embodiment Construction

[0019] The following will clearly and completely describe the technical solutions in the embodiments of the present invention with reference to the accompanying drawings in the embodiments of the present invention. Obviously, the described embodiments are only some, not all, embodiments of the present invention. The following description of at least one exemplary embodiment is merely illustrative in nature and in no way taken as limiting the invention, its application or uses. Based on the embodiments of the present invention, all other embodiments obtained by persons of ordinary skill in the art without creative efforts fall within the protection scope of the present invention.

[0020] The relative arrangements of components and steps, numerical expressions and numerical values ​​set forth in these embodiments do not limit the scope of the present invention unless specifically stated otherwise. At the same time, it should be understood that, for the convenience of descriptio...

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

PUM

No PUM Login to View More

Abstract

A novel CPU liquid cooling radiator, comprising a first main cold plate for cooling a first CPU, the first main cold plate is fixed on a heat conducting first main cold plate base, the first main cold plate A flow channel is arranged in the cold plate, one end of the first main cold plate is provided with a cooling liquid inlet, and the other end of the first main cold plate is provided with a cooling liquid outlet; the base of the first main cold plate faces the first One end of the VR is extended to form a first extension portion, and a first heat conduction pad is fixed below the first extension portion, and the bottom of the first heat conduction pad is in close contact with the first VR. The invention not only solves the problem of liquid-cooling pipeline routing in the early stage, but also eliminates the VR air-cooled heat sink, and reduces the cost.

Description

technical field [0001] The invention relates to the technical field of CPU cooling, in particular to a novel CPU liquid cooling radiator. Background technique [0002] With the continuous increase of server CPU power consumption, the power consumption of the next-generation CPU will reach 300W, and it is difficult to solve the heat of the CPU with traditional air cooling. At present, liquid cooling technology has been widely used in server heat dissipation, and there are more detailed liquid cooling solutions for major heating components such as CPU and GPU. However, during the layout of the liquid-cooled tubes, due to the short distance between the CPU and the CPU VR chip (hereafter referred to as VR) responsible for the power supply of the CPU, the VR air-cooled heat sink often interferes with the liquid-cooled tubes, which requires a large distance between the tubes. The bending bypasses the heat sink, which reduces the reliability of the liquid cooling tube. [0003] T...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

Application Information

Patent Timeline
no application Login to View More
Patent Type & Authority Patents(China)
IPC IPC(8): G06F1/20G06F1/18
CPCG06F1/183G06F1/20
Inventor 张宇川
Owner INSPUR SUZHOU INTELLIGENT TECH CO LTD