Three-dimensional (3D) printer large-size forming platform leveling device

A 3D printer and leveling device technology, applied in the field of 3D printing, can solve the problems of increasing the resistance of the forming platform, inflexible leveling, and inflexible leveling devices.

Pending Publication Date: 2020-08-07
SHENZHEN ANYCUBIC TECH CO LTD
View PDF7 Cites 3 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, most of the existing leveling devices for light-curing forming platforms are only suitable for small-sized forming sheet platforms. For large-sized forming platforms of 8.9 inches and 10.1 inches, if the current leveling method is still used, the leveling device is not flexible on the one hand, and on the other hand On the one hand, the forming platform is heavier and the forming area is larger, the release adsorption force is greater when the forming

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Image

Smart Image Click on the blue labels to locate them in the text.
Viewing Examples
Smart Image
  • Three-dimensional (3D) printer large-size forming platform leveling device
  • Three-dimensional (3D) printer large-size forming platform leveling device
  • Three-dimensional (3D) printer large-size forming platform leveling device

Examples

Experimental program
Comparison scheme
Effect test

Embodiment Construction

[0031] In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the specific implementation manners of the present invention will be described below with reference to the accompanying drawings. Obviously, the accompanying drawings in the following description are only some embodiments of the present invention, and those skilled in the art can also obtain other accompanying drawings based on these drawings and obtain other implementations.

[0032] In order to make the drawing concise, each drawing only schematically shows the parts related to the present invention, and they do not represent the actual structure of the product. In addition, to make the drawings concise and easy to understand, in some drawings, only one of the components having the same structure or function is schematically shown, or only one of them is marked. Herein, "a" not only means "only one", but also means "more than one".

[0033] The t...

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to view more

PUM

No PUM Login to view more

Abstract

The invention provides a three-dimensional (3D) printer large-size forming platform leveling device which comprises a support frame structure, and a platform upper pressing block and a platform lowerpressing block connected through an elastic connecting assembly. During leveling, a lifting device drives the support frame structure so as to drive the platform upper pressing block, the platform lower pressing block and a printing platform to move as a whole; in the process of fitting the printing platform to an exposure screen, due to an elastic function of the elastic connecting assembly, theprinting platform can swing in various directions and at various angles such as front and back as well as left and right within a certain range, so that the printing platform moderately contacts the exposure screen, the fitting degree of the printing platform and the exposure screen is high, and a leveling effect is further achieved. Therefore, the leveling device provided by the scheme is high inflexibility, the parallelism of the levelled printing platform and the exposure screen is high, a curing layer can be well bonded onto a forming platform, and even if the forming platform is heavierand the forming area is larger, a cured finished product can be firmly bonded onto the forming platform when the forming platform is lifted, so that a model curing success rate is greatly improved.

Description

technical field [0001] The invention belongs to the technical field of 3D printing, and in particular relates to a leveling device of a 3D printer applicable to a large-size forming platform. Background technique [0002] DLP (Digital Light Processing, digital light processing) 3D printer refers to a printing device that solidifies liquid photosensitive resin through projector imaging technology to print out three-dimensional objects. DLP 3D printers are also called DLP light-curing 3D printers because of the use of light sources to cure photosensitive resins. [0003] Existing light-curing 3D printers include: a projector, a liquid tank, a lifting mechanism, and a forming platform; the forming platform is fixed on the lifting mechanism through a bracket, and can move up and down with the drive of the lifting mechanism during the printing process; the liquid tank is used for Hold the resin that can be cured after being irradiated by ultraviolet light of a specific wavelengt...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to view more

Application Information

Patent Timeline
no application Login to view more
IPC IPC(8): B29C64/124B29C64/245B29C64/20B33Y30/00
CPCB33Y30/00B29C64/124B29C64/20B29C64/245
Inventor 王敬杰欧阳欣
Owner SHENZHEN ANYCUBIC TECH CO LTD
Who we serve
  • R&D Engineer
  • R&D Manager
  • IP Professional
Why Eureka
  • Industry Leading Data Capabilities
  • Powerful AI technology
  • Patent DNA Extraction
Social media
Try Eureka
PatSnap group products

Browse by: Latest US Patents, China's latest patents, Technical Efficacy Thesaurus, Application Domain, Technology Topic.

© 2024 PatSnap. All rights reserved.Legal|Privacy policy|Modern Slavery Act Transparency Statement|Sitemap