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Semiconductor processing equipment

A processing equipment and semiconductor technology, applied in the direction of crystal growth, from chemically reactive gases, instruments, etc., can solve the problems that the flatness of the base cannot be monitored in real time, and the accuracy of the flatness of the base cannot be guaranteed, so as to ensure the continuity of the process , to avoid contamination of the base, to ensure the consistency of the effect

Inactive Publication Date: 2020-08-07
BEIJING NAURA MICROELECTRONICS EQUIP CO LTD
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  • Abstract
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  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0004] In view of the shortcomings of the existing methods, this application proposes a semiconductor processing equipment to solve the technical problems in the prior art that the accuracy of the flatness of the base cannot be guaranteed and the flatness of the base cannot be monitored in real time

Method used

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  • Semiconductor processing equipment
  • Semiconductor processing equipment

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Embodiment Construction

[0021] The present application is described in detail below, and examples of embodiments of the present application are shown in the drawings, wherein the same or similar reference numerals denote the same or similar components or components having the same or similar functions throughout. Also, detailed descriptions of known technologies will be omitted if they are not necessary to illustrate the features of the present application. The embodiments described below by referring to the figures are exemplary only for explaining the present application, and are not construed as limiting the present application.

[0022] Those skilled in the art can understand that, unless otherwise defined, all terms (including technical terms and scientific terms) used herein have the same meanings as commonly understood by those of ordinary skill in the art to which this application belongs. It should also be understood that terms, such as those defined in commonly used dictionaries, should be ...

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Abstract

The embodiment of the invention provides semiconductor processing equipment which comprises a process chamber, a base and a leveling device, wherein the base is arranged in the process chamber and isused for bearing a wafer; the leveling device comprises a distance measuring sensor, the distance measuring sensor is arranged outside the process cavity and located above the base, the distance measuring sensor is used for measuring the distance value between the distance measuring sensor and the upper surface of the base, and the leveling device calculates the flatness of the base according to the distance value and levels the base according to the flatness. According to the embodiment of the invention, the base can be subjected to distance measurement and leveling without opening the process chamber, the base can be effectively prevented from being polluted, and the flatness of the base can be accurately measured, so that the accuracy of adjusting the flatness of the base is ensured. Because the process chamber does not need to be cooled, the process continuity is ensured, the process efficiency is improved, and the yield of the wafer is greatly improved.

Description

technical field [0001] The present application relates to the technical field of semiconductor processing, and in particular, the present application relates to a semiconductor processing equipment. Background technique [0002] At present, the working principle of chemical vapor deposition epitaxial growth equipment is to transport the process gas to the process chamber, react it by heating and other means, and deposit the growth atoms on the wafer and other substrates to grow a single crystal layer. During epitaxial growth, the wafer is placed on the upper surface of the base, and the process gas passes over the silicon wafer. The flatness of the base will affect the consistency of the deposition thickness inside the wafer to a certain extent. In the face of higher-end customers, the process standards are relatively strict, and the flatness measurement method of the existing base is to place the two ends of the horizontal positioning column on the preheating ring respecti...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C30B25/12C30B25/16G01B11/14G01B11/30G01B17/00G01B17/08
CPCC30B25/12C30B25/16G01B11/14G01B11/30G01B17/00G01B17/08
Inventor 王欢商家强
Owner BEIJING NAURA MICROELECTRONICS EQUIP CO LTD
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