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A fast-curing, high-heat-resistant, high-toughness resin matrix and its preparation method

A resin matrix and rapid curing technology, which is applied in the field of composite materials, can solve the problems of low curing degree, large temperature fluctuation of resin matrix, and poor microwave response, and achieve the improvement of resin curing uniformity, microwave curing rate, and microwave absorption. high performance effect

Active Publication Date: 2021-06-08
BEIJING UNIV OF CHEM TECH
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Generally speaking, there are technical defects in the microwave-curable resin matrix reported in the literature: First, due to the single component and low polarity of the resin matrix, the microwave response is poor and the curing degree is not high, the cross-linking network structure is not perfect, and the thermal Compared with curing, its glass transition temperature is lower and its heat resistance is poor; the second is to improve the polarity of the resin matrix, enhance its microwave absorption performance, and accelerate the microwave curing rate, thereby introducing nano-components, but nano-components are in The dispersion uniformity of the resin matrix is ​​poor, thereby reducing the strength and toughness of the material; third, compared with thermal curing, microwave curing has a faster reaction speed, and the heat of the resin matrix during the reaction process is difficult to conduct quickly, which is easy to cause resin explosion. The fourth is that the microwave curing process is too simple. Whether it is continuous microwave, pulse microwave or microwave curing in stages according to the power, the change of the microwave absorption ability of the resin system with the reaction process is often ignored, resulting in large temperature fluctuations of the resin matrix. It affects the curing uniformity of the resin, and ultimately cannot realize the simultaneous online regulation of the performance of the cured product and the process; fifth, microwave-cured samples are mostly prepared by closed-type curing of resin in a microwave curing oven, which has strict requirements on the curing environment and cannot meet the actual requirements. need

Method used

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  • A fast-curing, high-heat-resistant, high-toughness resin matrix and its preparation method
  • A fast-curing, high-heat-resistant, high-toughness resin matrix and its preparation method
  • A fast-curing, high-heat-resistant, high-toughness resin matrix and its preparation method

Examples

Experimental program
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Effect test

Embodiment 1

[0022] The main resin is polyfunctional cycloaliphatic epoxy resin (EHPE3150), and the modified component of amidated ionic liquid is 1-vinyl-3-(2-amino-2-oxyethyl)imidazole bis(trifluoromethanesulfonate) Prepolymer of amido)imide salt and 4,5-epoxyhexane-1,2-diglycidyl carboxylate, the highly polar curing agent uses 1,3-bis-(γ-aminopropyl)- 5,5-Dimethylhydantoin, magnetic ionic liquid modified nano-components use 1-methyl-3-butylimidazolium tetrachloride ferric salt to modify carbon nanotubes, active diluent uses diglycidyl adipate Ester and carbon fiber are T700 from Toray Corporation of Japan. The mass ratio of the main resin, the amidated ionic liquid modified component, the highly polar curing agent, the magnetic ionic liquid modified nano component and the reactive diluent is 100:4:30:0.1:30. The preparation process is as follows: Diglycidyl 4,5-epoxyhexane-1,2-dicarboxylate, 1-vinyl-3-(2-amino-2-oxyethyl)imidazole bis(trifluoromethanesulfonate The acyl imide salt is m...

Embodiment 2

[0027]The main resin is triglycidyl isocyanate (TGIC), and the modified component of amidated ionic liquid is 1-formamide-1-methylpiperidine bistrifluoromethanesulfonimide salt and 4,5-epoxy Prepolymer of diglycidyl hexane-1,2-dicarboxylate, high polar curing agent using 1,3-bis-(γ-aminopropyl)-5,5-dimethylhydantoin and 2, 2-bis(amino-4-hydroxyphenyl)hexafluoropropane (BAHPFP) is a compound with a mass fraction of 10:10, and the magnetic ionic liquid is modified with N,N-hexyl-p-N-methylimidazole Thiocyanate-modified graphene oxide, the active diluent is ethylene glycol diglycidyl ether, and the carbon fiber is T700 from Toray Corporation of Japan. The mass ratio of the main resin, amidated ionic liquid modified component, highly polar curing agent, magnetic ionic liquid modified nano component and reactive diluent is 100:10:40:1:20. The preparation process is as follows: Diglycidyl 4,5-epoxyhexane-1,2-dicarboxylate, 1-formamide-1-methylpiperidine bistrifluoromethanesulfonyl ...

Embodiment 3

[0032] The main resin is a compound of multifunctional cycloaliphatic epoxy resin (EHPE3150) and triglycidyl isocyanurate (TGIC) with a mass fraction of 40:60, and the modified component of amidated ionic liquid is 1-( Prepolymer of 2-amino-2-oxyethyl)-1-propylpyrrolidinium dicyanamide salt with diglycidyl 4,5-epoxyhexane-1,2-dicarboxylate, highly polar The curing agent is a mixture of 1-cyanoethyl-2-ethyl-4-methylimidazole and 2,2-bis(amino-4-hydroxyphenyl)hexafluoropropane (BAHPFP) with a mass fraction of 5:10 1-methyl-3-butylimidazolium ferric chloride salt and N, N-hexyl p-N-methylimidazolium thiocyanate dysproscenium are used in the mass fraction of 0.6:0.6 for magnetic ionic liquid modified nanometer components Compound Modified TiO 2 Nanoparticles / Fe 3 o 4 For nanowire / graphene, the active diluent is ethylene glycol diglycidyl ether and diglycidyl adipate with a mass fraction of 50:50, and the carbon fiber is T700 from Toray Corporation of Japan. The mass ratio of t...

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Abstract

A fast-curing, high-heat-resistant, high-toughness resin matrix and a preparation method thereof belong to the field of composite materials. The present invention selects multi-functional high-performance epoxy resin as the main resin, selects amidated ionic liquid modification components to adjust the heat resistance and toughness of the resin system, and selects a high-polarity curing agent to adjust the pot life, curing activity and crosslinking of the resin system. Structure, select magnetic ionic liquid modified nanoparticles to adjust the microwave absorption of the resin system, add active diluent to adjust the viscosity of the resin system to meet the requirements of the molding process. By adjusting the structure and proportion of the main resin, amidated ionic liquid modified component, high polarity curing agent and ionic liquid modified nano component, etc., a kind of high microwave absorption and good dispersion of nano particles has been invented. , Suitable viscosity, fast curing speed, uniform curing, excellent mechanical properties, good heat resistance microwave curing resin system. It has guiding significance for the rapid preparation of high-performance resin-based composite materials, and can be widely used in aerospace and other fields.

Description

technical field [0001] The invention belongs to the field of composite materials, and mainly relates to a fast-curing, high-heat-resistant, high-toughness resin matrix and a preparation method thereof. Background technique [0002] Epoxy resin-based composite material is a thermosetting resin-based composite material with excellent performance. Epoxy resin-based composite material has high specific strength, high specific modulus, corrosion resistance, fatigue resistance, good damping and vibration reduction, and good dimensional stability. , mechanical properties and strong designability, etc., have been widely concerned in aerospace, transportation, wind power generation, sporting goods, marine shipbuilding and other industrial fields, and have been applied on a large scale. Epoxy resin-based composites are widely used in fields such as aerospace and marine exploration, and epoxy resins are also widely used as underfills and sealants in the microelectronics and electronics...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): C08L63/00C08K9/04C08K3/04C08K7/06C08K13/06C08K7/08C08K3/22C08G59/50C08G59/56C08G59/62B29C39/02B29C39/22B29C39/38B29C39/44
CPCB29C39/02B29C39/22B29C39/38B29C39/44C08G59/5073C08G59/56C08G59/623C08K2003/2241C08K2201/011C08K2201/014C08L63/00C08L2201/08C08L2205/025C08L2205/03C08K9/04C08K3/041C08K7/06C08K3/042C08K13/06C08K3/22C08K7/08
Inventor 贾晓龙罗锦涛黎何丰史可刘聪还献华杨小平
Owner BEIJING UNIV OF CHEM TECH