Source follower tube and forming method of CMOS sensor

A source-following, active-region technology, applied in the direction of diodes, electric solid-state devices, semiconductor devices, etc., can solve the problems of carrier scattering, affecting the image quality of CMOS sensors, and increasing the impact, so as to improve the effect of disturbance

Pending Publication Date: 2020-08-11
SHANGHAI HUALI MICROELECTRONICS CORP
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Problems solved by technology

Therefore, the edge of the buried channel 140 is in contact with the edge of the STI structure 130, and the oxide filled in the STI structure 130 is silicon dioxide, therefore, the charge signal on the floating diffusion node 700 is used for Adjust the source follower transistor 400 to convert the charge into a voltage, and output the current to the analog-to-digital conversion circuit through the row selection transistor 600. During this step, when the current-carrying electrons pass through the buried channel 140, they will be separated from the shallow trench isolation structure 130 The impact of the silicon dioxide interface will cause serious scattering of the carriers, which will affect the anti-noise ability of the transistor and ultimately affect the quality of the image obtained by the CMOS sensor.
And as the size of the CMOS sensor decreases, the influence of this scattering behavior increases

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  • Source follower tube and forming method of CMOS sensor
  • Source follower tube and forming method of CMOS sensor
  • Source follower tube and forming method of CMOS sensor

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Embodiment Construction

[0031] The specific implementation manner of the present invention will be described in more detail below with reference to schematic diagrams. The advantages and features of the present invention will be more apparent from the following description. It should be noted that all the drawings are in a very simplified form and use imprecise scales, and are only used to facilitate and clearly assist the purpose of illustrating the embodiments of the present invention.

[0032] Hereinafter, the terms "first", "second", etc. are used to distinguish between similar elements, and are not necessarily used to describe a specific order or chronological order. It is to be understood that these terms so used are interchangeable under appropriate circumstances. Similarly, if a method described herein includes a series of steps, the order in which these steps are presented is not necessarily the only order in which these steps can be performed, and some described steps may be omitted and / or...

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Abstract

The invention provides forming methods of a source electrode following tube and a CMOS sensor. The method for forming the source electrode following tube comprises the steps: providing a substrate, and forming an active region and a shallow trench isolation structure adjacent to the active region on the substrate; forming a buried channel in the active region, wherein two sides of the buried channel are in contact with the shallow trench isolation structure; forming gate silicon oxide on the active region; partially etching the middle position of the gate silicon oxide to form patterned gate silicon oxide with a thin middle part and two thick sides; and forming a gate structure on the gate silicon oxide and the shallow trench isolation structure. According to the invention, patterned gatesilicon oxide with two thick sides and a thin middle part is formed through etching, so that a large part of carriers in the buried channel are transmitted from the middle part of the patterned gate silicon oxide so as to be far away from the interface of the shallow trench isolation structure, improve the disturbance of the interface of the shallow trench isolation structure to the carriers, improve the anti-noise capability of the CMOS sensor and improve the quality of an image obtained by the CMOS sensor.

Description

technical field [0001] The invention relates to the technical field of semiconductors, in particular to a method for forming a source follower transistor and a CMOS sensor. Background technique [0002] Usually, an active pixel unit of a CMOS image sensor includes a P+ / N+ / P- photodiode 200 (PD, Photo Diode) located in the P-type epitaxial layer 100 and several transistors. Taking a 4T structure CMOS image sensor as an example, four The transistors specifically include a transfer transistor 300 (TX, Transfer), a source follower transistor 400 (SF, Source Follow), a reset transistor 500 (RST, Reset) and a row selection transistor 600 (RS, Row Select). figure 1 A schematic diagram of a 4T structured CMOS image sensor is shown. [0003] Such as figure 1 The basic working principle of the CMOS image sensor shown is as follows: before lighting, the reset transistor 500 and the transfer transistor 300 are turned on to release the original electrons in the area of ​​the photodiode...

Claims

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Application Information

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IPC IPC(8): H01L27/146
CPCH01L27/14683H01L27/14689H01L27/14614H01L27/14643
Inventor田志李娟娟邵华陈昊瑜
OwnerSHANGHAI HUALI MICROELECTRONICS CORP