Cooling fin

Abstract

The invention relates to the technical field of heat dissipation, in particular to a cooling fin. The cooling fin comprises an alloy substrate and a cooling liquid circulating mechanism, and a first connecting nozzle and a second connecting nozzle are symmetrically and fixedly installed on one side face of the alloy base plate. The first connecting nozzle is communicated with one end of the S-shaped channel, and the second connecting nozzle is communicated with the other end of the S-shaped channel. The cooling liquid circulating mechanism comprises a base, a cylindrical sealing shell, a firstconnecting pipe, a first locking cap, a second connecting pipe, a second locking cap, a connecting base, a connecting shaft, a cylindrical assembling base, blades and a motor. According to the invention, the installation is more convenient, and the cooling fin has the excellent heat conduction and heat dissipation performance; the cooling liquid can be used for being matched with the alloy substrate to conduct heat dissipation on the portion, with serious heating, in a communication device, the heat dissipation effect can be guaranteed, but also dust can be prevented from entering the communication device, the heat dissipation requirement of the communication device can be well met, and the normal operation of the communication device can be effectively guaranteed.

Description

technical field [0001] The invention relates to the technical field of heat dissipation, and more specifically, it relates to a heat sink. Background technique [0002] Electronic communication equipment includes some equipment including integrated circuits, transistors and electronic tubes, such as routers and some computer-related equipment. These electronic communication equipment will generate a lot of heat during operation. If the heat is not discharged in time, it will affect electronic communication. For the normal operation of the equipment, it is necessary to carry out timely heat dissipation treatment on the electronic communication equipment. The conventional heat dissipation treatment usually uses a cooling fan. The function of the cooling fan is to speed up the air exchange. However, when the electronic equipment generates a lot of heat, The heat dissipation effect of the heat dissipation fan is just difficult to meet the needs, and the heat dissipation effect i...

AI Technical Summary

Problems solved by technology

[0002] Electronic communication equipment includes some equipment including integrated circuits, transistors and electronic tubes, such as routers and some computer-related equipment. These electronic communication equipment will generate a lot of heat during operation. If the heat is not discharged in time, it will affect electronic communication. For the normal operation of the equipment, it is necessary to carry out timely heat dissipation treatment on the electronic communication equipment. The conventional heat dissipation treatment usually uses a cooling fan. The function of the cooling fan is to speed up the air exchange. However, when the electronic equipment generates more heat, The heat dissipation effect of the cooling fan is difficult to meet the needs, and the heat dissipation effect is poor.

[0003] In addition, the cooling fan is used to dissipate heat from the communication equipment. The installation of the cooling fan is inconvenient. When the cooling fan is used to dissipate the heat in the parts of the communication equipment that are seriously heated, not only the heat dissipation effect cannot be guaranteed, but it is also easy to cause dust to enter the interior of the communication equipment. , resulting in the cooling fan not being able to better meet the heat dissipation requirements of the communication equipment, which in turn leads to the cooling fan not being able to effectively ensure the normal operation of the communication equipment

Images