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A wafer protection mechanism, device and method

A technology of protection mechanism and protection device, applied in the direction of grinding device, grinding drive device, grinding/polishing safety device, etc., can solve problems such as device damage, wafer damage or slipping out

Active Publication Date: 2020-10-23
XIAN ESWIN SILICON WAFER TECH CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0003] Because the thickness of the wafer is very thin, it is easy to damage or slip out the wafer during the process of improving the flatness by grinding or polishing. It is easy to cause damage to devices that improve flatness such as grinding devices or polishing devices

Method used

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  • A wafer protection mechanism, device and method
  • A wafer protection mechanism, device and method
  • A wafer protection mechanism, device and method

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Embodiment Construction

[0022] The following will clearly and completely describe the technical solutions in the embodiments of the present invention with reference to the drawings in the embodiments of the present invention.

[0023] The directional terms such as up, down, left, right, front, back, front, back, top, and bottom that are mentioned or may be mentioned in this specification are defined relative to the structures shown in the drawings, and they are It is a relative concept, so it may change accordingly according to its different positions and different usage states. Accordingly, these or other directional terms should not be construed as limiting terms.

[0024] At present, the wafer production and processing process mainly includes main steps such as ingot growth, ingot cutting and outer diameter grinding, ingot slicing to obtain wafers, wafer surface grinding, polishing, and cleaning. After cleaning, the wafers can be inspected. Packaged and shipped for chip fabrication. For the wafe...

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Abstract

The embodiment of the present invention discloses a wafer protection mechanism, device and method; the mechanism may include: a first drive motor, a first drive shaft assembly, a second drive shaft assembly, and a clutch; wherein, the first drive shaft The assembly is connected to the first drive motor, and the clutch member is provided at the connection between the first drive shaft assembly and the second drive shaft assembly to engage or disengage the first drive shaft assembly and the second drive shaft assembly; the clutch separates the first drive shaft assembly from the second drive shaft assembly under a set torque torque; the set torque torque is used to indicate a wafer breakage or slip-out state.

Description

technical field [0001] Embodiments of the present invention relate to wafer processing technology, and in particular to a wafer protection mechanism, device and method. Background technique [0002] In the wafer processing process, after cutting the crystal bar or silicon ingot produced by the crystal pulling process to obtain the wafer, in order to reduce the damage of the wafer surface, contamination of impurities, and thickness deviation or fluctuation caused by cutting, usually Grinding and polishing the diced wafers can reduce the damage and impurities on the wafer surface, and eliminate the unevenness or undulation of the wafer surface to improve the flatness. [0003] Because the thickness of the wafer is very thin, it is easy to damage or slip out the wafer during the process of improving the flatness by grinding or polishing. It is easy to cause damage to devices that improve flatness such as grinding devices or polishing devices. In order to avoid the occurrence ...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): B24B37/10B24B37/34B24B29/02B24B47/12B24B41/04B24B55/00H01L21/306
CPCB24B29/02B24B37/042B24B37/107B24B37/34B24B41/04B24B47/12B24B55/00H01L21/30625
Inventor 王建新
Owner XIAN ESWIN SILICON WAFER TECH CO LTD