Electronic tag and chip packaging structure thereof

Abstract

The invention discloses an electronic tag and a chip packaging structure thereof. The tag comprises a machine shell, a transmission mechanism is arranged in the machine shell, the lower portion of thetransmission mechanism is connected with an extrusion mechanism, the extrusion mechanism is arranged in the machine shell, a material collecting mechanism is arranged below the extrusion mechanism, and the material collecting mechanism is installed on the machine shell; the lifting of the extrusion mechanism can be adjusted through the arranged transmission mechanism; the extrusion mechanism canbe used for heating and softening the label shell while extruding the electronic label shell; the electronic chip can be packaged in the shell of the electronic tag, so that a sealing function is achieved, and the electronic tag and the chip which are packaged after being extruded by the extrusion mechanism can fall into the material collecting box from a baffle to be collected through the arranged material collecting mechanism. The packaging structure has a rapid packaging function, can package a plurality of chips at a time, and can collect the plurality of packaged chips through the material collecting mechanism.

Description

technical field [0001] The invention belongs to the technical field of electronic label packaging, and in particular relates to an electronic label and a chip packaging structure thereof. Background technique [0002] Electronic tags are used in a wide range. Electronic tags are also called radio frequency tags, transponders, and data carriers; readers are also called readout devices, scanners, reading heads, communicators, and readers. The spatial coupling of the radio frequency signal is realized through the coupling element between the electronic tag and the reader; in the coupling channel, energy transmission and data exchange are realized according to the timing relationship. [0003] The existing electronic tags cannot be connected by bolts or bolts, the chip is small, and the operation is inconvenient. In the process of production and installation, the snap-on chip is generally used to realize the installation, but this method will make the chip in the process of use....

AI Technical Summary

Problems solved by technology

[0004] The purpose of the present invention is to provide an electronic label and its chip packaging structure, which can solve the problem of the chip being not firmly connected in the process of using it, especially when it is used on some air ducts. If the vibration is large, it is easy to cause the electronic tag connected to the air duct to resonate, causing the chip inside the electronic tag to be disconnected, so that the electronic tag cannot operate normally.

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