Test point automatic positioning method and copper thickness automatic detection method and system

Abstract

The invention discloses a test point automatic positioning method and a copper thickness automatic detection method and system. The method comprises the steps of collecting an image of a PCB; findingout a hole matched with the feature information of the target positioning hole from the image according to the feature information of the target positioning hole, and taking the hole as the target positioning hole; calculating a distance between the target positioning hole and an X axis and a distance between the target positioning hole and a Y axis of an equipment coordinate system, and determining a coordinate value of a test point in the equipment coordinate system in combination with a coordinate value of the test point in the plate coordinate system; According to the coordinate value ofthe test point under the equipment coordinate system, controlling a probe to move so as to be accurately positioned on the test point. According to the method, the coordinate value of each test pointon the PCB can be determined on the equipment coordinate system by converting the plate coordinate system and the equipment coordinate system, so that the probe can be automatically and accurately positioned on the test point, the accuracy and stability of copper thickness data measurement are ensured, and the production efficiency is improved.

Description

technical field [0001] The invention relates to the technical field of copper thickness automatic detection, in particular to an automatic positioning method for a test point, a copper thickness automatic detection method and a system. Background technique [0002] In the production process of the PCB board, the PCB board needs to be electroplated, and the copper layer is plated on both sides of the PCB board. In order to ensure that the transmission of current and signal meets the requirements of the PCB board, the copper thickness needs to be tested. [0003] At present, most of the detection of copper thickness in the PCB industry is still done manually by operators. Specifically, the operator manually moves the probe to a test point on the PCB, and then the probe performs copper thickness detection. This method consumes a high labor cost, and the detection accuracy is easily affected by the professionalism of the operator, and the production efficiency is extremely low....

AI Technical Summary

Problems solved by technology

At present, for the determination of the position coordinates of the test points, the traditional method still requires human intervention. For example, the operator uses measuring tools to measure the size of the positioning hole from the edge of the board. The process is very cumbersome and inefficient.

[0005] In view of this, how to provide an efficient and accurate test point positioning method to avoid the limitations of the prior art due to manual positioning is a technical issue to be solved urgently by those skilled in the art.

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