LED display module lamp seam glue pouring method and system

Abstract

The invention discloses an LED display module lamp seam glue pouring method and system. The LED display module lamp seam glue pouring method comprises the steps of enabling lamp beads of LED display modules to be closely covered with a layer of adhesive tape, and enabling the adhesive tape to be closely attached to each lamp bead; cutting the adhesive tape to form a plurality of adhesive tape strips, wherein the adjacent adhesive tape strips are exposed out of lamp seams; and glue is uniformly sprayed into the lamp seams. According to the LED display module lamp seam glue pouring method and system, the LED display modules can have the waterproof, damp-proof and anti-collision protection performance. Meanwhile, the LED display modules which are kept in a discrete state are arranged among the LED lamp beads, the light emitting efficiency of the LED lamp beads cannot be affected, and the advantage that a traditional LED display screen is free of the modularization effect and is easy to maintain is reserved as the protection performance of the LED display screen is improved.

Description

technical field [0001] The invention relates to the field of display screens, in particular to a method and system for filling glue into lamp seams of LED display modules. Background technique [0002] With the advancement of technology and the needs of the market. LED (Light Emitting Diode, Light Emitting Diode) display screens are developing toward a direction in which dot pitches become smaller and smaller, so as to be able to display more delicate images. However, this also brings another problem: to achieve a small dot pitch, small LED beads are required. And small lamp beads will cause the welding area to be too small, so that the bonding strength between the LED lamp beads and the PCB will become lower and lower, causing the small-pitch LED display to become more and more fragile, during transportation, disassembly and maintenance. It is easy to cause the LED lamp beads to fall due to bumps. On the other hand, at present, due to packaging factors, LED lamp beads ar...

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Problems solved by technology

However, this also brings another problem: to achieve a small dot pitch, small LED lamp beads are required

[0004] In the process of realizing the embodiment of the present invention, the inventor found that in the above method, due to the difference in the height and size of the multiple lamp beads on the module and the manufacturing process installed on the circuit board, the multiple lamp beads on the circuit board There is a height difference between each lamp bead, and the shielding net is made of metal material. The shielding net is rigid, and the shielding net cannot completely fit the lamp beads with a lower height. Therefore, during the glue spraying process, the glue will flow from the shielding net to the height. The lower lamp bead covers the lamp bead in the gap, and then the glue will cover the entire lamp bead, which will affect the light output efficiency of the lamp bead

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