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Circuit substrate arrangement with improved electrical contact

A technology of circuit base and circuit layer, applied in the direction of circuit, printed circuit, printed circuit, etc., can solve problems such as electrical contact, and achieve the effect of easy cost, improved electrical contact, and wide application range

Pending Publication Date: 2020-08-28
ROBERT BOSCH GMBH
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, if the base layer is an aluminum based layer, electrical contact problems arise between the base layer (aluminum) based on a different metal substrate and the wiring layer (copper)

Method used

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  • Circuit substrate arrangement with improved electrical contact
  • Circuit substrate arrangement with improved electrical contact
  • Circuit substrate arrangement with improved electrical contact

Examples

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Embodiment Construction

[0016] Refer below figure 1 and 2 The line base device 1 according to a first preferred embodiment of the present invention will be described in detail.

[0017] as available from figure 1 As seen in , the circuit base device 1 of this embodiment is a so-called IMS (insulated metal substrate) having a base layer 2 containing aluminum, a dielectric layer 4 and a circuit layer 3 containing copper.

[0018] The dielectric layer 4 is arranged as an intermediate layer between the base layer 2 and the circuit layer 3 and electrically separates these two layers. In this case, the dielectric layer 4 is applied directly on the base layer 2 and the wiring layer 3 is applied directly on the dielectric layer 4 .

[0019] Through the use of an aluminum-based base layer, a particularly cost-effective circuit base arrangement 1 can be provided compared to other materials for the base layer, wherein particularly high thermal powers can be reliably transferred by the base layer 2 containing...

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PUM

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Abstract

The present invention relates to a circuit substrate arrangement comprising a base layer (2) made from aluminium, a circuit layer (3) made from copper, a dielectric layer (4) arranged between the baselayer (2) and the circuit layer (3), an opening (5) passing through the base layer (2), the circuit layer (3) and the dielectric layer (4) and an electrical contact (6) between the base layer (2) andthe circuit layer (3), wherein the electrical contact (6) comprises a rivet (7), a frictionally connected joint (8) is formed between the rivet (7) and the base layer (2) and an integrally bonded joint (9) is formed between the rivet (7) and the circuit layer (3).

Description

technical field [0001] The present invention relates to a circuit base assembly having significantly improved electrical contact. Background technique [0002] Line base arrangements are known in various designs from the prior art. For example, so-called IMS (isolated metal substrates) are known in the form of single-layer or multi-layer circuit boards, which are laminated on a metal substrate, in particular containing copper or aluminium. This metal substrate enables better thermal expansion and contraction of power dissipation. However, copper-based IMSs are significantly more expensive than aluminum-based IMSs here, given the generally identical design. In addition to the base layer, the IMS also includes a copper-based wiring layer and a dielectric intermediate layer between the base layer and the wiring layer. However, if the base layer is an aluminum-based layer, electrical contact problems arise between the base layer (aluminum) based on a different metal substrate...

Claims

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Application Information

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IPC IPC(8): H01L23/14H01L23/498H05K3/40H05K3/44
CPCH01L23/142H01L23/3735H05K3/4046H05K1/053H05K2201/10303H05K1/116H05K1/119
Inventor T·维萨A·梅尔S·于内
Owner ROBERT BOSCH GMBH
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