Thermal superconducting heat dissipation plate, radiator and 5G base station equipment
A technology for base station equipment and radiator substrates, which is applied in the field of thermal superconducting heat sinks, radiators and 5G base station equipment, and can solve uneven heat dissipation, large volume of all-aluminum sheet-slotted radiators or die-cast radiators, which cannot meet the requirements of heat dissipation Requirements and other issues to achieve the effect of improved heat dissipation performance
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Embodiment 1
[0039] Such as Figure 1 to Figure 3 As shown, the present invention provides a thermal superconducting heat dissipation plate 3, the thermal superconducting heat dissipation plate 3 includes a first heat dissipation area A and a second heat dissipation area B located on the top of the first heat dissipation area A; A first heat dissipation pipeline 33 is distributed in the heat dissipation area A, and the first heat dissipation pipeline 33 is distributed in a polygonal honeycomb shape; a second heat dissipation pipeline is distributed in the second heat dissipation area B, and the second heat dissipation pipeline It includes a plurality of second main pipes 341 and a plurality of second branches 342 connected between the second main pipes 341, the second main pipes 341 extend along the width direction of the thermal superconducting cooling plate 3 and The end of the second main pipe 341 away from the device 2 (substantially also the end away from the heat sink substrate 1) is...
Embodiment 2
[0053] Such as Figure 4As shown, the present invention also provides a thermal superconducting cooling plate 3 with another structure. The main difference between the thermal superconducting cooling plate 3 of this embodiment and the first embodiment is that in the first embodiment, the second main pipe 341 and the third main pipe 351 are arc-shaped pipes, and the first The arc-shaped convex direction of the second main pipeline 341 and the third main pipeline 351 is downward (that is, the side with a smaller inclination angle of the second main pipeline 341 and the third main pipeline 351 is close to the device 2); and in this implementation In the example, although the second main pipe 341 and the third main pipe 351 are also arc-shaped pipes, the arc-shaped convex direction of the second main pipe 341 and the third main pipe 351 faces (that is, the side with a larger inclination angle of the second main pipe 341 and the third main pipe 351 is close to the device 2). Thro...
Embodiment 3
[0056] Such as Figure 5 to Figure 7 As shown, the present invention also provides a thermal superconducting radiator, which includes a radiator substrate 1 and a plurality of thermal superconducting radiator plates 3 as described in any one of the first or second embodiments; The heat sink substrate 1 has a first surface and a second surface opposite to the first surface, and the first surface is provided with a plurality of installation areas for placing devices 2 from bottom to top; the plurality of thermal superconducting cooling plates 3 are arranged in parallel on the second surface of the heat sink substrate 1 at intervals, and each of the thermal superconducting heat sinks 3 extends longitudinally (that is, the device 2 is located on the side of the thermal superconducting heat sink, that is, the The thermal superconducting heat sink described above is heat conduction on the side).
[0057] As an example, there are three installation areas, and the three installation ...
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