A highly integrated thinning equipment

Abstract

The present disclosure relates to a highly integrated thinning equipment, comprising: a front-end module of the equipment, which is arranged at the front end of the thinning equipment; a grinding module, which is arranged at the end of the thinning equipment; a polishing module, which is arranged at the end of the thinning equipment. Between the front-end module of the equipment and the grinding module; the polishing module includes a post-processing unit for post-processing the chemically mechanically polished substrate, and the post-processing unit includes The horizontal brushing device and the single-chamber cleaning device are arranged adjacently. The disclosure provides the most economical and effective technical route for processing substrates by combining grinding, chemical mechanical polishing, and cleaning and drying processes. It has a compact structure and high integration, and can provide technical support for ultra-high-density semiconductor stacking processes. , is an important component of the development of semiconductor high-density packaging.

Description

technical field [0001] The present disclosure relates to the technical field of semiconductor substrate processing, in particular to a highly integrated thinning device. Background technique [0002] In the post-process stage of integrated circuit / semiconductor (Integrated Circuit, referred to as "IC") manufacturing, in order to reduce the package mounting height, reduce the chip package volume, improve the thermal diffusion efficiency, electrical performance, mechanical performance of the chip, and reduce the The amount of processing required, the substrate needs to be back-thinned before subsequent packaging, and the thickness of the chip after back-thinning can even reach less than 5% of the initial thickness. [0003] With the rapid development of IC manufacturing technology, in order to increase the output of IC chips and reduce the cost of unit manufacturing, the diameter of the substrate tends to be larger. However, existing equipment is mostly used for processing sm...

AI Technical Summary

Problems solved by technology

However, the increase in the size of the substrate brings a series of problems such as the substrate is prone to warping and deformation, the surface accuracy and surface roughness requirements are not easy to guarantee, and the processing efficiency is low. The existing processing technology and equipment cannot meet the requirements.

Moreover, due to the high cost of the substrate processing plant, there is a high requirement for the space occupancy rate. If the equipment size is too large, the space will be wasted and the production cost will increase.

[0005] All in all, the thinning process for large-size substrates in the prior art has the problems of poor processing effect, low surface quality, and high production cost

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