Highly integrated thinning equipment

Abstract

The invention relates to highly integrated thinning equipment. The highly integrated thinning equipment comprises an equipment front end module arranged at the front end of the thinning equipment, a grinding module arranged at the tail end of the thinning equipment, and a polishing module arranged between the equipment front end module and the grinding module; the polishing module comprises a post-processing unit for post-processing a substrate after chemical mechanical polishing, and the post-processing unit comprises a horizontal brushing device and a single-cavity cleaning device which areadjacently arranged in the width direction of the thinning equipment. By combining grinding, chemical mechanical polishing and cleaning and drying processes, the most economical and effective technical route for processing the substrate is provided, the structure is compact, the integration level is high, technical guarantee is provided for a semiconductor stacking process with ultra-high density,and the highly integrated thinning equipment is an important component of semiconductor high-density packaging development and the like.

Description

technical field [0001] The present disclosure relates to the technical field of semiconductor substrate processing, in particular to a highly integrated thinning device. Background technique [0002] In the post-process stage of integrated circuit / semiconductor (Integrated Circuit, referred to as "IC") manufacturing, in order to reduce the package mounting height, reduce the chip package volume, improve the thermal diffusion efficiency, electrical performance, mechanical performance of the chip, and reduce the The amount of processing required, the substrate needs to be back-thinned before subsequent packaging, and the thickness of the chip after back-thinning can even reach less than 5% of the initial thickness. [0003] With the rapid development of IC manufacturing technology, in order to increase the output of IC chips and reduce the cost of unit manufacturing, the diameter of the substrate tends to be larger. However, existing equipment is mostly used for processing sm...

AI Technical Summary

Problems solved by technology

However, the increase in the size of the substrate brings a series of problems such as the substrate is prone to warping and deformation, the surface accuracy and surface roughness requirements are not easy to guarantee, and the processing efficiency is low. The existing processing technology and equipment cannot meet the requirements.

Moreover, due to the high cost of the substrate processing plant, there is a high requirement for the space occupancy rate. If the equipment size is too large, the space will be wasted and the production cost will increase.

[0005] All in all, the thinning process for large-size substrates in the prior art has the problems of poor processing effect, low surface quality, and high production cost

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