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Device and method for measuring thermal expansion coefficient of solid material based on image sensing

A technology of thermal expansion coefficient and solid materials, applied in measuring devices, analyzing materials, adopting mechanical devices, etc., can solve the problems that long-term measurement cannot be completed automatically, and measurement conditions are limited

Pending Publication Date: 2020-09-08
NANJING UNIV OF SCI & TECH
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  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

[0006] The main purpose of the present invention is to provide a new device and method for measuring the thermal expansion coefficient of solid materials, which solves the problem that the measurement conditions are limited in the measurement of the thermal expansion coefficient of solid materials, and the long-term measurement cannot be completed automatically

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  • Device and method for measuring thermal expansion coefficient of solid material based on image sensing
  • Device and method for measuring thermal expansion coefficient of solid material based on image sensing
  • Device and method for measuring thermal expansion coefficient of solid material based on image sensing

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Embodiment

[0047] In this embodiment, a calibration plate with a straight line engraved with an interval of 0.5 mm is used for calibration. The calibration plate is as follows Figure 6 As shown, the straight line detected on the calibration board is as Figure 8 shown. It can be calculated that the average distance between straight lines is 24.8 pixels, so it can be obtained that the real physical distance corresponding to the distance of one pixel on the image is 0.5 / 24.8=0.0202mm.

[0048] In this embodiment, an aluminum alloy plate is selected as the measured object, and the temperature range of the measurement is -50°C to 50°C, and the temperature interval is 10°C. The images collected are as Figure 9 As shown, the image detection and matching feature points collected at -50°C and -40°C are as follows: Figure 10 shown. It can be calculated that the average point displacement is 0.7574 pixels, and the corresponding actual moving distance is 0.7574×0.0202=0.0153mm, so the averag...

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Abstract

The invention discloses a device and method for measuring the thermal expansion coefficient of a solid material based on image sensing. The device is composed of a long-working-distance microscopic system, an adjusting device, an illumination and indication light source, a high-low temperature box, a calibration plate and a measurement control system. The long-working-distance microscopic system is used for measuring to-be-measured objects with different lengths; the adjusting device is used for fixing the long-working-distance microscopic system and adjusting the height, the position in the horizontal direction and the pitch angle of the long-working-distance microscopic system; the illumination and indication light source is used for illumination during measurement and indication duringadjustment; the high-low temperature box is used for adjusting the temperature in the box; the calibration plate is used for calculating a conversion relationship between the pixel length on the imageand the actual physical length; the measurement control system is used for turning on and turning off the illumination light source, automatically controlling the temperature of the high-low temperature box, displaying and storing images shot by the long-working-distance microscopic system, automatically calculating the thermal expansion coefficient and storing measurement data. The device is small in limitation of measurement conditions, and can be used for measuring materials of different sizes.

Description

technical field [0001] The invention relates to a technique for measuring the coefficient of thermal expansion of solid materials, in particular to a device and method for measuring the coefficient of thermal expansion of solid materials based on image sensing. Background technique [0002] In nature, thermal expansion of objects is ubiquitous, which brings a lot of inconvenience to people's life and industrial manufacturing. Especially in the manufacture of precision instruments, precision machinery and testing technology, changes in temperature will cause thermal deformation of certain objects being processed and measured. The linear expansion coefficient of a material is one of the basic thermophysical parameters of a substance and an important characteristic quantity that characterizes the properties of a material. Generally speaking, the main parameter to measure the thermal deformation of an object is called the "thermal expansion coefficient" of the material making u...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): G01N19/00
CPCG01N19/00
Inventor 蔡华俊宋旸刘梦涵施雨清
Owner NANJING UNIV OF SCI & TECH