Adapter plate easy for SIP packaging bottom filling and manufacturing method thereof

A technology of underfill and transfer board, which is applied in semiconductor/solid-state device manufacturing, semiconductor/solid-state device components, electrical components, etc., can solve the problems of insufficient filling, underfill, product failure, etc., to increase the filling space , Increase the height and ensure the effect of product reliability

Active Publication Date: 2020-09-08
JCET GROUP CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0002] At present, some large SIP products are directly surface-mounted with relatively large-sized QFN or LGA products and directly filled with plastic encapsulants. However, the bottom spacing of these products is generally less than 50um after surface-mounting, and it is difficult for the plastic encapsulant to completely fill the bottom. , there will be insufficient filling, which may lead to failure of subsequent products

Method used

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  • Adapter plate easy for SIP packaging bottom filling and manufacturing method thereof
  • Adapter plate easy for SIP packaging bottom filling and manufacturing method thereof
  • Adapter plate easy for SIP packaging bottom filling and manufacturing method thereof

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Embodiment Construction

[0026] The present invention will be further described in detail below in conjunction with the accompanying drawings and embodiments.

[0027] see figure 1 , figure 2 , the present invention relates to a kind of adapter board that is easy to fill the bottom of SIP package, it includes copper column layer 1, and the pattern of described copper column layer 1 is corresponding to the pattern of soldering pad at the bottom of mounting component, and between the copper column layers 1 Filling and setting a medium material 2, the medium material 2 adopts a water-soluble material;

[0028] The water-soluble material has low-temperature curing characteristics, and after curing, it is solid at low temperature, and softens and is easily dissolved by water at high temperature;

[0029] The size of the adapter board is the same as the size of the mounted components.

[0030] Its manufacturing method comprises the following steps:

[0031] Step 1, see image 3 , take a copper substra...

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Abstract

The invention relates to an adapter plate easy for SIP packaging bottom filling and a manufacturing method thereof, the adapter plate comprises copper column layers (1), the patterns of the copper column layers (1) correspond to the patterns of welding pads at the bottom of a subsequent mounting element, dielectric materials (2) are filled between the copper column layers (1), and the dielectric materials (2) are water-soluble materials. According to the adapter plate easy to fill the bottom of the SIP package and the manufacturing method of the adapter plate, the gap at the bottom of the surface mount device can be raised, so that the plastic package material is easier to fill.

Description

technical field [0001] The invention relates to an adapter board which is easy to fill the bottom of SIP packaging and a manufacturing method thereof, belonging to the technical field of semiconductor packaging. Background technique [0002] At present, some large SIP products are directly surface-mounted with relatively large-sized QFN or LGA products and directly filled with plastic encapsulants. However, the bottom spacing of these products is generally less than 50um after surface-mounting, and it is difficult for the plastic encapsulant to completely fill the bottom. , there will be insufficient filling, which may lead to failure of subsequent products. Contents of the invention [0003] The technical problem to be solved by the present invention is to provide an adapter board that is easy to fill the bottom of the SIP package and its manufacturing method for the above-mentioned prior art, which can raise the gap at the bottom of the surface mount device and make it e...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H01L23/498H01L21/48H01L21/60
CPCH01L23/49816H01L23/49838H01L21/4853H01L24/81H01L2224/81345
Inventor 李全兵顾骁宋健
Owner JCET GROUP CO LTD
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