Cooling device

Abstract

Provided is a cooling device capable of improving bonding reliability between a base block and a heat pipe, while reducing environmental load, and capable of achieving both excellent contact heat transfer coefficient and vibration resistance. A cooling device (1) is provided with: a base block (10) having a rear surface section (10a) thermally connected to an electric component (300), i.e., a heatgenerating body; a heat pipe group (20) comprising a plurality of heat pipes (21) each having a first cylindrical section (21a), which is fixed to a front surface section (10b) of the base block (10), and which is disposed in the in-plane direction of the base block (10), and a second cylindrical section (21b), which is connected to the first cylindrical section (21a), and which stands from the base block (10); and a fin group (30) comprising a plurality of fins (31, 31, and so on) that are fixed by being aligned in parallel to each other in the standing direction of the heat pipe group (20).

Description

technical field [0001] The present invention relates to a cooling device for cooling electric / electronic components and the like, and more particularly relates to a cooling device for cooling electric / electronic components mounted on moving bodies such as railway vehicles. Background technique [0002] Conventionally, there is known a cooling device that cools a heating element using latent heat when a refrigerant boils, as a cooling device used for cooling a control device or the like using a semiconductor element. [0003] As such a cooling device, for example, a cooler has been proposed in which a plurality of circular tubular tanks are embedded in a base block receiving heat from a heat generating body such as a semiconductor element, and multiple tube-shaped tanks are erected on the side of the exposed portion of the tank. A thin tube and a plurality of fins are installed in the tube, so that the heat of the heating element can be cooled by the outside air (Patent Docum...

AI Technical Summary

Problems solved by technology

[0006] However, in the above-mentioned cooler, since the base block and each tank are integrally joined by soldering, and lead-containing solder is used in the joint portion of the base block and a plurality of tanks, the environmental load is large.

[0007] Therefore, in consideration of the environmental load, a method of using lead-free solder instead of the above-mentioned lead-containing solder has been considered, but since lead-free solder has poor wettability and unstable bonding force compared with lead-containing solder, there is concern about the joint between the base block and the heat pipe. Contact thermal conductivity, vibration resistance of joints when used in moving bodies such as vehicles

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