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Multipiece element storage package, and multipiece optical semiconductor device

A technology for optical semiconductor devices and packages, which is applied in the direction of semiconductor devices, semiconductor lasers, and single semiconductor device testing, and can solve problems such as time loss and productivity reduction

Active Publication Date: 2020-09-18
KYOCERA CORP
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

For this reason, when a large number of semiconductor laser devices are burnt in, time loss is caused by connecting the electrodes of a large number of semiconductor laser devices to the terminals of the burn-in device, and productivity may be reduced.

Method used

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  • Multipiece element storage package, and multipiece optical semiconductor device
  • Multipiece element storage package, and multipiece optical semiconductor device
  • Multipiece element storage package, and multipiece optical semiconductor device

Examples

Experimental program
Comparison scheme
Effect test

Embodiment Construction

[0027] Hereinafter, an example of embodiment of the multi-chip type component storage package of this disclosure is demonstrated with reference to drawings.

[0028] Figure 1A It is a plan view which shows an example of embodiment of the disclosed multi-chip type component storage package. Figure 1B It is an example showing an embodiment of the multi-chip type component storage package of the present disclosure. Figure 1A Top view from the opposite side. figure 2 so Figure 1A The cross-sectional view of the cut surface line A-A cut.

[0029] The multi-chip device housing package 1 of this embodiment includes a motherboard 10 , a first dry electrode 14 , and a second dry electrode 15 .

[0030] The mother substrate 10 is an insulating substrate made of an electrically insulating material. The motherboard 10 has a first surface 10a and a second surface 10b opposite to the first surface 10a. The mother substrate 10 has a direction along the first direction ( Figure 1A , ...

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PUM

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Abstract

The multipiece element storage package according to the present disclosure is provided with: a motherboard including a plurality of first element storage package regions, a plurality of second elementstorage package regions, and a dummy region, the motherboard having a first surface and a second surface; a first trunk electrode installed in the dummy region of the first surface; and a second trunk electrode installed on the second surface. The first element storage package regions and the second element storage package regions each include: a frame body installed on the first surface; a firstwiring conductor installed on the first surface, one end of the first wiring conductor being located on the inner side of the frame body and the other end of the first wiring conductor being connected to the first trunk electrode; and a second wiring conductor, one end of the second wiring conductor being located on the inner side of the frame body and the other end of the second wiring conductorbeing connected to the second trunk electrode.

Description

technical field [0001] The present disclosure relates to a multi-chip type element housing package and a multi-chip type optical semiconductor device. Background technique [0002] Compared with the light emitting diode (Light Emitting Diode), the semiconductor laser element (Laser Diode) can emit light with the same wavelength and phase. For this reason, semiconductor laser elements have advantages over light-emitting diode elements in the field of image display devices such as high-brightness display devices and scanning display devices. [0003] In recent years, the miniaturization of semiconductor laser elements has been advancing. Along with this, it is desired to efficiently burn-in a large number of semiconductor laser elements, a large number of semiconductor laser devices each including a semiconductor laser element, and the like. For example, Patent Document 1 describes that evaluation of element characteristics, aging, and the like are performed in a state where...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H01S5/022H01L21/60H01L23/02H01L23/04H01L33/62H01S5/0239
CPCH01L2224/18H01L25/167H01S5/0021H01S5/02208H01S5/023H01S5/02345H01S5/02355G01R31/2884G01R31/2635H01S5/0239H05K1/0296H05K1/0306H05K2201/10121H05K2201/10522
Inventor 上山大辅堂本千秋
Owner KYOCERA CORP