Desoldering suction nozzle, device disassembling device and method for carrying out desoldering with desoldering suction nozzle

Abstract

The invention relates to a desoldering suction nozzle, a device disassembling device and a method for carrying out desoldering with the desoldering suction nozzle. The desoldering suction nozzle comprises a suction head, and a suction hole is formed in the end of the suction head to suck a device to be disassembled on a circuit board. The end of the suction head extends outwards to form a stirringtable, the stirring table and the suction hole are staggered, and thus the stirring table can abut against the side face of the device to be disassembled to push the device to be disassembled. By means of the structure of the desoldering suction nozzle and the desoldering mode, a soldering disc can be heated and can be disassembled with lateral thrust after being heated to a certain degree, the defects of a traditional structure and a traditional method are overcome, the desoldering success rate is not influenced by vacuum suction force or the surface cleanness degree of the device to be disassembled such as a lamp bead / MiniIC chip, the damage to the soldering disc in the desoldering process is small, and the working efficiency and the repair yield of repair equipment can be greatly improved.

Description

technical field [0001] The invention relates to the field of desoldering, more specifically, to a desoldering suction nozzle, a component removal device and a desoldering method using the desoldering suction nozzle. Background technique [0002] As we all know, Mini / Micro LED has excellent performance and is expected to become a new trend of LED display. LCD display using Mini LED backlight technology is superior to current LCD displays in terms of brightness, contrast, color reproduction and energy saving, and can even compete with AMOLED. Control production costs. [0003] Technological progress drives Mini LED to be upgraded as a small-pitch display product. As an extension of small-pitch technology, Mini LED is expected to usher in application penetration in the field of commercial and home display. The breakthrough of four-in-one packaging technology is the key to the landing of Mini LED products. [0004] COB is the core packaging technology suitable for Mini / Micro ...

AI Technical Summary

Problems solved by technology

[0009] After the pad is melted, the viscosity is very strong. The suction nozzle is affected by the small size of the lamp bead / MiniIC device (typical value 0.1-0.3mm), and the area of ​​the suction surface that can be provided is very small. ) is also very small, and affected by the smoothness of the contact surface of the device, it is often difficult for the actual suction force to make the lamp bead / MiniIC device successfully detach from the viscous force of the pad, and the success rate and efficiency of the desoldering process are low; this desoldering method is also will damage the pad

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