Die-casting alloy material for high-thermal-conductivity high-yield mobile phone middle plate and preparation method thereof

Abstract

The invention relates to a die-casting alloy material for a high-thermal-conductivity high-yield mobile phone middle plate and a preparation method thereof. The alloy comprises 10-12 wt% of Si, 1.0-2.0 wt% of Mg, less than 0.5 wt% of Mn, less than 0.5 wt% of Ce, less than 0.5 wt% of Zn, 0.1-0.5 wt% of Fe, 0.01-0.1 wt% of Ti, 0.005-0.1 wt% of Sr, 0.002-0.05 wt% of B, and the balance Al, wherein thecontent of other impurities is controlled below 0.01 wt%. Compared with the prior art, the Mn, Si, Mg and Ce are added into the aluminum alloy, a ternary strengthening phase Mg2Si, MnAl6 and Al11Ce3binary precipitation phase is introduced, the yield strength and the elongation rate of the material are remarkably improved, meanwhile, the Ce and B elements are doped into the aluminum alloy, and the thermal conductivity of the die-casting alloy is greatly improved by utilizing the performances of the Ce and B elements.

Description

technical field [0001] The invention relates to an aluminum alloy, in particular to a high thermal conductivity and high yield die-casting alloy material for a middle plate of a mobile phone and a preparation method thereof. Background technique [0002] The mobile phone mid-board refers to the substrate inside the high-end smartphone, which is mainly used to support the internal circuit board of the mobile phone and dissipate the heat generated by the internal chips and lines of the mobile phone in time. Its thickness is generally thin, about 0.5mm. The performance of the middle board of the mobile phone requires the material to have high strength to ensure the strength required for it to support the circuit board; the material is required to have excellent thermal conductivity so that the internal temperature can be transferred to the edge in time and released in time; The material is required to have excellent forming performance, so as to facilitate stamping and small-an...

AI Technical Summary

Problems solved by technology

First of all, the structure of the middle plate of the mobile phone is more complicated. The ordinary stamped aluminum strip can no longer meet its design requirements. The die-casting and molding methods can deal with the complex structure inside the mobile phone and can form ultra-thin and high-strength mobile phone structural components. However, the traditional The yield strength can only reach about 160MPa, the elongation is below 2%, and the thermal conductivity is less than 100W / (m·K)

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